Bimetallic Structure of Ti6Al4V/IN718 with CuSi Interlayer for Wire-Arc Directed Energy Deposition Process

Fabricating bimetallic structures using various additive manufacturing processes is an ingenious way to integrate different material properties in a single component. This study offers a novel method for fabricating Ti6Al4V and IN718 bimetallic structures using a wire-arc-based directed energy depos...

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Bibliographic Details
Published in:Metals and materials international 2023, 29(8), , pp.2331-2344
Main Authors: Mishra, Avinash, Paul, Amrit Raj, Mukherjee, Manidipto, Singh, Rabesh Kumar
Format: Article
Language:English
Subjects:
Arc deposition
Bimetals
Bonding strength
Characterization and Evaluation of Materials
Chemistry and Materials Science
Copper
Engineering Thermodynamics
Heat and Mass Transfer
Interfaces
Interlayers
Intermetallic phases
Machines
Magnetic Materials
Magnetism
Manufacturing
Material properties
Materials Science
Mechanical properties
Metallic Materials
Metallurgical analysis
Nickel
Processes
Solid Mechanics
Thickness
Titanium base alloys
Wire
재료공학
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Summary:Fabricating bimetallic structures using various additive manufacturing processes is an ingenious way to integrate different material properties in a single component. This study offers a novel method for fabricating Ti6Al4V and IN718 bimetallic structures using a wire-arc-based directed energy deposition process with a CuSi interlayer, both with and without the addition of pure copper powder at the CuSi–TI6AlV interface. The Cu–Ti and Ni–Cu interfaces of the bimetallic structure have been examined in terms of their metallurgical and mechanical characteristics. The study revealed the presence of Cu 4 Ti 3 , Cu 3 Ti 2 , Cu 4 Ti, CuTi 2 and Ti 5 Si 3 phases at the Cu–Ti interface, whereas CuNi and NiCr 2 phases at the Ni–Cu interface. The Cu–Ti interface with copper powder shows two distinctive layers of intermetallic phases with less intermetallic thickness compared to the interface without copper powder. The maximum bonding strength of 152.31 ± 40.74 MPa and hardness of ~ 485 HV were achieved in the interface without a copper powder sample. However, for interface with copper powder sample, the presence of Ti 5 Si 3 hindered the further transformation of less stable Cu–Ti phases resulting in decreased strength. Graphical abstract
ISSN:1598-9623
2005-4149
DOI:10.1007/s12540-022-01381-8