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Thermal stability and Young's modulus of mechanically exfoliated flexible mica

In recent years, mica has been successfully used as a substrate for the growth of flexible epitaxial ferroelectric oxide thin films. Here, we systematically investigated the flexibility of mica in terms of its thickness, repeated bending/unbending, extremely hot/cold conditions, and successive therm...

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Published in:Current applied physics 2018, 18(12), , pp.1486-1491
Main Authors: Jin, Da Woon, Ko, Young Joon, Kong, Dae Sol, Kim, Hyun Ki, Ha, Jae-Hyun, Lee, Minbaek, Hong, Jung-Il, Jung, Jong Hoon
Format: Article
Language:English
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Summary:In recent years, mica has been successfully used as a substrate for the growth of flexible epitaxial ferroelectric oxide thin films. Here, we systematically investigated the flexibility of mica in terms of its thickness, repeated bending/unbending, extremely hot/cold conditions, and successive thermal cycling. A 20-μm-thick sheet of mica is flexible even up to the bending radius of 5 mm, and it is durable for 20,000 cycles of up- and down-bending. In addition, the mica shows flexibility at 10 and 773 K, and thermal cycling stability for the temperature variation of ca. 400 K. Compared with the widely used flexible polyimide, mica has a significantly higher Young's modulus (ca. 5.4 GPa) and negligible hysteresis in the force-displacement curve. These results show that mica should be a suitable substrate for piezoelectric energy-harvesting applications of ferroelectric oxide thin films at extremely low and high temperatures. [Display omitted] •Flexibility of mica up to bending radius of 5 mm and excessive bending cycle of 20,000.•Stable flexibility at a wide temperature range of 10–773 K.•High Young's modulus and negligible hysteresis of force-displacement curve.
ISSN:1567-1739
1878-1675
DOI:10.1016/j.cap.2018.09.002