A Large-Area Electronics Processing Platform Using Laser Technology for the Customization of Liquid Crystal Displays

• Published in: Electronic materials letters 2009, 5(4), , pp.195-200
• Main Authors: Jay Yatulis, Ryan Butler, Mathew Higgins, Curtis LaPlante, 전철규, 김우영, 채수조
• Format: Article
• Language: English
• Subjects: 전자/정보통신공학
• ISSN: 1738-8090; 2093-6788
• DOI: 10.3365/eml.2009.12.195

This research entailed the development of cost effective method to re-size LCD glass with a Mean Time to Failure (MTF) of greater than or equal to uncut glass. A Carbon Dioxide laser was completed on a standard 3-axis materials processing platform with alignment tolerances of up to 50 microns. The many key cutting factors and the variables that generated the most success included the operation of the laser in pulsed mode, the incorporation of a dry Nitrogen gas assist at close proximity to the LCD glass, relatively slow translational speeds, and laser output powers of up to up to 7 Joule 20ns pulse widths before focusing optics were used. Only at these higher output powers could the display be completely penetrated with minimal thermal damage, but in conjunction with the slower translational speeds and moderate gas assists pressures of approximately 15PSI, adequate cooling was provided to salvage most types of LCD technologies tested. KCI Citation Count: 3