Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead-Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi

Preventing the formation of large platelets of Ag 3 Sn intermetallic compounds (IMCs) during solidification of solder joints has become a significant challenge in the design of Sn–Ag–Cu lead-free solder alloys. Large platelets of Ag 3 Sn are generally considered as undesirable as their presence can...

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Bibliographic Details
Published in:Metals and materials international 2021, 27(10), , pp.4294-4305
Main Authors: El-Taher, A. M., Razzk, A. F.
Format: Article
Language:English
Subjects:
Alloying additive
Alloying elements
Alloys
Anisotropy
Bismuth
Characterization and Evaluation of Materials
Chemistry and Materials Science
Cobalt
Copper
Creep strength
Engineering Thermodynamics
Heat and Mass Transfer
Intermetallic compounds
Iron
Lead free
Machines
Magnetic Materials
Magnetism
Manufacturing
Materials Science
Melt temperature
Metallic Materials
Morphology
Platelets
Processes
Silver
Solders
Solid Mechanics
Solidification
Supercooling
Tellurium
Thermodynamic properties
Tin
Tin base alloys
재료공학
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Summary:Preventing the formation of large platelets of Ag 3 Sn intermetallic compounds (IMCs) during solidification of solder joints has become a significant challenge in the design of Sn–Ag–Cu lead-free solder alloys. Large platelets of Ag 3 Sn are generally considered as undesirable as their presence can create solidification defects and causes mechanical property anisotropy. In the present work, the synergetic effects of adding 0.1 wt% of Fe, Co, Te and 2 wt% Bi to Sn–3.0Ag–0.7Cu (SAC 307) solder are studied in terms of the growth of large platelets Ag 3 Sn IMCs and the resulting alloy’ creep resistance as well as their thermal behavior. Although minor Fe, Co, Te and Bi alloying elements addition causes large increase in the degree of undercooling from 3.4 to 22.3 °C with maintaining the pasty range and melting temperature at the same levels, the modified SAC307–FeTeCoBi alloy exhibits considerable increase in creep resistance (~ 10 times) and large fracture life-time than SAC (307) solder at same stress levels and testing temperatures. This is attributed to the transition of Ag 3 Sn IMCs from large platelets into fine needle-like morphology and formation of new (Cu,Co) 6 Sn 5 , FeSn 2 , SnTe IMCs and Bi particles, which could provide more obstacles for dislocation movement at the interphase boundaries. Graphic Abstract
ISSN:1598-9623
2005-4149
DOI:10.1007/s12540-020-00856-w