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Additive manufacturing of nanotube-loaded thermosets via direct ink writing and radio-frequency heating and curing

Direct Ink Writing (DIW) is an extrusion-based additive manufacturing method where the print medium is a liquid-phase ‘ink’ dispensed out of nozzles and deposited along digitally defined paths. Conventional DIW of thermosetting resins relies on viscosity modifying agents, novel crosslinking chemistr...

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Bibliographic Details
Published in:Carbon (New York) 2022-11, Vol.200 (C), p.307-316
Main Authors: Sarmah, Anubhav, Desai, Suchi K., Crowley, Ava G., Zolton, Gabriel C., Tezel, Guler Bengusu, Harkin, Ethan M., Tran, Thang Q., Arole, Kailash, Green, Micah J.
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Language:English
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Summary:Direct Ink Writing (DIW) is an extrusion-based additive manufacturing method where the print medium is a liquid-phase ‘ink’ dispensed out of nozzles and deposited along digitally defined paths. Conventional DIW of thermosetting resins relies on viscosity modifying agents, novel crosslinking chemistries, and/or long curing schedules in an oven. Here we demonstrate the use of a co-planar radio frequency applicator to generate an electric field, which can be used to rapidly heat and cure nano-filled composite resins as they are printed. This method avoids the need for an oven or post-curing step. This process consists of a sequential print-and-cure cycle which allows for printing of high-resolution, multi-layered structures. Every extruded layer is partially cured using RF before depositing the next layer; this allows the printed part to maintain structural integrity. The process enables both increased throughput and decreased touch time relative to traditional manufacturing. Commercial epoxy resin with varied nano-filler loadings were examined as DIW candidates. After printing, the thermo-mechanical properties, surface finish, and shape retention of RF-cured samples were comparable to conventionally cured samples. This method of manufacturing establishes RF heating as a suitable alternative to conventional methods, facilitating rapid, free-form processing of thermosetting resins without a mold. [Display omitted]
ISSN:0008-6223
1873-3891
DOI:10.1016/j.carbon.2022.08.063