Strain Field Analysis in Electronic Components by ESPI: Bad Thermal Contact and Damage Evaluation

• Published in: Journal of nondestructive evaluation 2018-03, Vol.37 (1), p.1-7, Article 11
• Main Authors: Casavola, C., Pappalettera, G.
• Format: Article
• Language: English
• Subjects: Characterization and Evaluation of Materials; Classical Mechanics; Component reliability; CONCENTRATION RATIO; Control; Current distribution; Damage assessment; Damage detection; DEFECTS; DEFORMATION; DESIGN; Dynamical Systems; Electronic components; Electronic devices; ELECTRONIC EQUIPMENT; Electronic speckle pattern interferometry; ENGINEERING; EVALUATION; HEAT SINKS; INTERFEROMETRY; Mechanical analysis; Mechanical properties; Numerical methods; Reliability aspects; Solid Mechanics; Strain; STRAINS; Stress concentration; THERMAL EXPANSION; Thermal stress; THERMAL STRESSES; Vibration
• ISSN: 0195-9298; 1573-4862
• DOI: 10.1007/s10921-018-0466-4

Designing electronic components and devices is a complex task that must include also considerations about thermo-mechanical behavior of the component itself. This aspect, in fact, can affect the reliability of the device as a consequence of the thermal stresses that are introduced in the component while it is working. Stress concentration can arise, in fact, due to different thermal expansion coefficients of the materials involved. Determining the thermo-mechanical response by numerically methods is not simple and not always possible so that experimental methods are preferable. In this paper, specifically, the electronic speckle pattern interferometry technique was adopted to measure full-field strain of the component during exercise. By using an optical technique it is possible to get information about the behavior of the component without being in contact with the component itself so that the dissipation coefficient is not altered. The system was able to detect gradients of deformation in the component itself connected to the different distribution of internal current in the component. Moreover, it was observed, that the presence of bad thermal contact between the package and the heat sink can be revealed because it results in a different thermos-mechanical behavior of the component. Finally, a critical defect was introduced in the component and it was observed the way the presence of damage affects the in-plane displacement of the component. Very huge differences were observed leading to the consideration that this kind of approach could be conveniently adopted also as a damage detection tool.