Loading…
A Study on the Microstructures and Properties of Selective Laser Melted Babbitt Metals
Babbitt metal cubes were prepared by means of selected laser melting (SLM) process using Sn—11% Sb—6% Cu alloy powders; their microstructures were studied using optical microscope (OM), SEM, EDS, XRD and DSC; and their mechanical properties were tested using Vickers hardness and tensile methods. The...
Saved in:
Published in: | Journal of materials engineering and performance 2019-09, Vol.28 (9), p.5433-5440 |
---|---|
Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | Babbitt metal cubes were prepared by means of selected laser melting (SLM) process using Sn—11% Sb—6% Cu alloy powders; their microstructures were studied using optical microscope (OM), SEM, EDS, XRD and DSC; and their mechanical properties were tested using Vickers hardness and tensile methods. The results show that fully dense Babbitt metal components can be prepared by using appropriate SLM process parameters and an interlayer staggered laser scanning strategy. Anisotropy characteristics appear in both the microstructure and mechanical properties of SLM-Babbitt cubic specimens. The average hardness was in the range of 32.5 HV0.05 to 35.3 HV0.05. Both tensile strength and elongation were somewhat higher in a direction parallel to the laser scanning speed (Y axis) than in a direction perpendicular to the laser scanning speed (X axis). The strengthening mechanism is suggested to include solid solution strengthening of oversaturated Sb in the Sn matrix, as well as dispersion strengthening of finely dispersed SnSb and Cu
6
Sn
5
particles. The overgrown acicular Cu
6
Sn
5
phases at low laser scanning speeds and void formation at higher laser scanning speeds seriously deteriorate the mechanical properties of the SLM-Babbitt specimens. |
---|---|
ISSN: | 1059-9495 1544-1024 |
DOI: | 10.1007/s11665-019-04332-4 |