CORRELATION OF DISPERSION STABILITY WITH SURFACTANT CONCENTRATION AND ABRASIVE PARTICLE SIZE FOR CHEMICAL MECHANICAL POLISHING (CMP) SLURRIES

• Published in: Journal of dispersion science and technology 2000-01, Vol.21 (5), p.491-509
• Main Authors: Palla, B.J., Shah, D.O.
• Format: Article
• Language: English
• Subjects: Chemistry; Colloidal state and disperse state; Exact sciences and technology; General and physical chemistry; Physical and chemical studies. Granulometry. Electrokinetic phenomena
• ISSN: 0193-2691; 1532-2351
• DOI: 10.1080/01932690008913286

The preparation of stable colloidal slurries is often difficult in industries where many chemical components are added into the slurries. A critically acclaimed example of such an industry is the chemical mechanical polishing (CMP) industry which involves polishing slurries with several chemical additives. In the present work, the stabilization of a slurry used for CMP of metals is investigated in detail. This high ionic strength slurry has been stabilized using an optimaJ combination of sodium dodecyl sulfate (anionic surfactant) and Tween 80 (nonionic surfactant). The amount of surfactant needed to impart stability has been investigated in this study for two different sizes of abrasive particles. It has been found that the amount of surfactant needed to stabilize the slurry increases as the total surface area per gram of panicles increases. Slurry stabilization has been correlated with particle size measurements. It has been found that the average panicle size of the slurry decreases as the stability of the slurry increases. Stable slurries have been found to have particle sizes close to those of the particles before agglomeration. It is proposed that the stabilized CMP slurries can lead to reduced defects in wafers by preventing agglomeration of panicles.