A Single-Chip 10-Band WCDMA/HSDPA 4-Band GSM/EDGE SAW-less CMOS Receiver With DigRF 3G Interface and 90 dBm IIP2

This paper describes the design and performance of a 90 nm CMOS SAW-less receiver with DigRF interface that supports 10 WCDMA bands (I, II, III, IV, V, VI, VIII, IX, X, XI) and 4 GSM bands (GSM850, EGSM900, DCS1800, PCS1900). The receiver is part of a single-chip SAW-less transceiver reference platf...

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Bibliographic Details
Published in:	IEEE journal of solid-state circuits 2009-03, Vol.44 (3), p.718-739
Main Authors:	Kaczman, D., Shah, M., Alam, M., Rachedine, M., Cashen, D., Lu Han, Raghavan, A.
Format:	Article
Language:	English
Subjects:	25% duty-cycle Acoustic wave devices, piezoelectric and piezoresistive devices Amplifiers Applied sciences Calibration Circuit properties complex IIP2 DCOC Design Design. Technologies. Operation analysis. Testing digital RF interface (DigRF) digitally assisted calibration direct conversion direct coupled filter (DCF) Downlink duplex noise figure EDGE EGPRS Electric, optical and optoelectronic circuits Electronic circuits Electronics EVM Exact sciences and technology Gain control GSM High speed integrated circuits high-speed downlink packet access (HSDPA) high-speed packet access (HSPA) IIP2 Integrated circuits multi-band multi-mode Multiaccess communication Noise Passive filters SAW-less Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Signal convertors Smart phones smartphone surface acoustic wave (SAW) filters transceiver Transceivers Transconductance wideband CDMA (WCDMA)
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