System Integration of Electronic Functions in Smart Packaging Applications

• Published in: IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2012-10, Vol.2 (10), p.1723-1734
• Main Authors: Nilsson, H., Unander, T., Siden, J., Andersson, H., Manuilskiy, A., Hummelgard, M., Gulliksson, M.
• Format: Article
• Language: English
• Subjects: Applied sciences; Demand; Design engineering; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; General equipment and techniques; Ink; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Integrated circuits; Large area sensors; Marketing; Packaging; Physics; printed electronics; Printing; Radio frequency; Resistance; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing; Silicon; Silver; smart packaging; Substrates; Systems integration; Three dimensional
• ISSN: 2156-3950; 2156-3985
• DOI: 10.1109/TCPMT.2012.2204056

A system integration scheme relevant for smart packaging applications is presented. Recent advances in printed electronics, radio frequency identification tag production, and standardization of communication protocols are factors that increase the design freedom for new applications. As in all new technology fields, the first products are expected to appear in the high-cost segment attracting early adopters in the form of niche products. A reasonable assumption is that these products will come from hybridization of different types of technologies. Such a scenario is likely since no technology solution available can provide all features that these types of applications demand. There is a need of standard solutions for hybridization of silicon devices and printed (or foil-type) components. Conductive ink technology is a powerful tool for hybridization and customization of large-area electronics, providing 3-D integration and large-area customization. However, high-performance communication and advanced processing demand the use of silicon. Smart hybridization solutions allow combination of the best from both worlds. This paper analyzes the requirements on hybridization technologies suitable for smart packaging applications and provides design examples on integration of intrusion surveillance solutions for cellulose-based packaging applications. It shows that even though the current hybridization technologies are far from optimal, they can provide a considerable design freedom and system performance.