A system for online detection and classification of wafer bin map defect patterns for manufacturing intelligence

Wafer bin maps (WBM) in circuit probe (CP) tests that present specific defect patterns provide crucial information to identifying assignable causes in the semiconductor manufacturing process. However, most semiconductor companies rely on engineers using eyeball analysis to judge defect patterns, whi...

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Bibliographic Details
Published in:International journal of production research 2013-04, Vol.51 (8), p.2324-2338
Main Authors: Chien, Chen-Fu, Hsu, Shao-Chung, Chen, Ying-Jen
Format: Article
Language:English
Subjects:
adaptive resonance theory
data mining
Defective products
Manufacturing
manufacturing intelligence
Neural networks
Process controls
semiconductor manufacturing
Semiconductors
Statistical process control
Studies
wafer bin map
yield enhancement
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Summary:Wafer bin maps (WBM) in circuit probe (CP) tests that present specific defect patterns provide crucial information to identifying assignable causes in the semiconductor manufacturing process. However, most semiconductor companies rely on engineers using eyeball analysis to judge defect patterns, which is time-consuming and not reliable. Furthermore, the conventional statistical process control used in CP tests only monitors the mean or standard deviation of yield rates and failure percentages without detecting defect patterns. To fill the gap, this study aims to develop a manufacturing intelligence solution that integrates spatial statistics and neural networks for the detection and classification of WBM patterns to construct a system for online monitoring and visualisation of WBM failure percentages and corresponding spatial patterns with an extended statistical process control chart. An empirical study was conducted in a leading semiconductor company in Taiwan to validate the effectiveness of the proposed system. The results show its practical viability and thus the proposed solution has been implemented in this company.
ISSN:0020-7543
1366-588X
DOI:10.1080/00207543.2012.737943