Loading…

Vertical atomic manipulation with dynamic atomic-force microscopy without tip change via a multi-step mechanism

Manipulation is the most exciting feature of the non-contact atomic force microscopy technique as it allows building nanostructures on surfaces. Usually vertical manipulations are accompanied by an abrupt tip modification leading to a change of contrast. Here we report on low-temperature experiments...

Full description

Saved in:
Bibliographic Details
Published in:Nature communications 2014-07, Vol.5 (1), p.4476, Article 4476
Main Authors: Bamidele, J., Lee, S.H., Kinoshita, Y., Turanský, R., Naitoh, Y., Li, Y.J., Sugawara, Y., Štich, I., Kantorovich, L.
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Manipulation is the most exciting feature of the non-contact atomic force microscopy technique as it allows building nanostructures on surfaces. Usually vertical manipulations are accompanied by an abrupt tip modification leading to a change of contrast. Here we report on low-temperature experiments demonstrating vertical manipulations of ‘super’-Cu atoms on the p (2 × 1) Cu(110):O surface, both extractions to and depositions from the tip, when the imaging contrast remains the same. These results are rationalized employing a novel and completely general method that combines density functional theory calculations for obtaining energy barriers as a function of tip height and a Kinetic Monte Carlo algorithm for studying the tip dynamics and extraction of manipulation statistics. The model reveals a novel multi-step manipulation mechanism combining activated jumps of ‘super’-Cu atoms to/from the tip with their drag by and diffusion on the tip. Understanding vertical manipulation mechanisms in atomic-force microscopy applications is a serious challenge. Here, the authors report vertical extraction and deposition processes of copper atoms at an oxidized copper surface, and rationalize the processes with a multi-step manipulation mechanism.
ISSN:2041-1723
2041-1723
DOI:10.1038/ncomms5476