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Effective Post-Silicon Validation of System-on-Chips Using Quick Error Detection
This paper presents the Quick Error Detection (QED) technique for systematically creating families of post-silicon validation tests that quickly detect bugs inside processor cores and uncore components (cache controllers, memory controllers, and on-chip interconnection networks) of multicore system...
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Published in: | IEEE transactions on computer-aided design of integrated circuits and systems 2014-10, Vol.33 (10), p.1573-1590 |
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Main Authors: | , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | This paper presents the Quick Error Detection (QED) technique for systematically creating families of post-silicon validation tests that quickly detect bugs inside processor cores and uncore components (cache controllers, memory controllers, and on-chip interconnection networks) of multicore system on chips (SoCs). Such quick detection is essential because long error detection latency, the time elapsed between the occurrence of an error due to a bug and its manifestation as an observable failure, severely limits the effectiveness of traditional post-silicon validation approaches. QED can be implemented completely in software, without any hardware modification. Hence, it is readily applicable to existing designs. Results using multiple hardware platforms, including the Intel® Core™ i7 SoC, and a state-of-the-art commercial multicore SoC, along with simulation results using an OpenSPARC T2-like multicore SoC with bug scenarios from commercial multicore SoCs demonstrate: 1) error detection latencies of post-silicon validation tests can be very long, up to billions of clock cycles, especially for bugs inside uncore components; 2) QED shortens error detection latencies by up to nine orders of magnitude to only a few hundred cycles for most bug scenarios; and 3) QED enables up to a fourfold increase in bug coverage. |
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ISSN: | 0278-0070 1937-4151 |
DOI: | 10.1109/TCAD.2014.2334301 |