Study on the Fluid–Structure Interaction at Different Layout of Stacked Chip in Molded Packaging

This study investigates fluid–structure interaction (FSI) analysis of stacked chip in the encapsulation of molded underfill packaging using ANSYS Coupling Work bench with fluid and structural solvers. During encapsulation, FSI analysis is applied to a molded package with different layouts, namely ca...

Full description

Saved in:
Bibliographic Details
Published in:Arabian journal for science and engineering (2011) 2017-11, Vol.42 (11), p.4743-4757
Main Authors: Ishak, M. H. H., Abdullah, M. Z., Aziz, M. S. Abdul, Saad, A. A., Abdullah, M. K., Loh, W. K., Ooi, R. C., Ooi, C. K.
Format: Article
Language:English
Subjects:
Deformation
Digital cameras
Displacement molding
Encapsulation
Engineering
Fluid-structure interaction
Humanities and Social Sciences
multidisciplinary
Packaging
Pressure distribution
Research Article - Mechanical Engineering
Science
Silicon
Solvers
Stress concentration
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This study investigates fluid–structure interaction (FSI) analysis of stacked chip in the encapsulation of molded underfill packaging using ANSYS Coupling Work bench with fluid and structural solvers. During encapsulation, FSI analysis is applied to a molded package with different layouts, namely cases 1–4 of stacked chip. An even ratio of inlet and outlet gate pressures is used to produce a regular melt front advancement. An experimental setup is fabricated to validate the simulation results in the FSI study. A digital camera is used to capture the melt front advancement and structural deformation. The interaction between structures (silicon chip) and epoxy molding compound (EMC) is displayed in the displacement profile. Maximum deformation is evaluated during the final stage of filling. The silicon die experiences von Mises stresses, which are monitored to observe the risk of die cracking. The results of this study showed that, the EMC flow front advancement was the fastest in case 4. The pressure distribution of each case was nearly identical, and the maximum von Mises stress was distributed unevenly at the middle of the stacked chip. The proposed analysis can serve as a reference and guide in designing and improving 3D integration packages in industry.
ISSN:2193-567X
1319-8025
2191-4281
DOI:10.1007/s13369-017-2659-z