Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter

•Heat sink with volumetric fraction of ψ=1.0 is more efficient than ψ=0.0 or ψ=0.5.•At low input heat, PCM filled HSU are highly efficient for passive cooling.•HSU with pin diameter of 3mm pin-fin heat sink filled at ψ=1.0 is more efficient.•A maximum enhancement in operation time is evidenced for φ...

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Bibliographic Details
Published in:International journal of heat and mass transfer 2018-02, Vol.117, p.861-872
Main Authors: Arshad, Adeel, Ali, Hafiz Muhammad, Khushnood, Shahab, Jabbal, Mark
Format: Article
Language:English
Subjects:
Enhancement ratio
Heat capacity
Heat conductivity
Heat exchangers
Heat Sink
Heat transfer
Paraffin wax
Phase change material
Round pin-fin
Set point temperatures
Studies
Thermal conductance
Thermal conductivity enhancers
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