A Computational Study of the Adsorptive Removal of H2S by MOF-199

• Published in: Journal of inorganic and organometallic polymers and materials 2018-05, Vol.28 (3), p.694-701
• Main Authors: Zhang, Hong-Yan, Zhang, Zhen-Rong, Yang, Chao, Ling, Li-Xia, Wang, Bao-Jun, Fan, Hui-Ling
• Format: Article
• Language: English
• Subjects: Adsorption; Adsorptivity; Binding sites; Chemistry; Chemistry and Materials Science; Computer simulation; Copper; Density functional theory; Dimers; Hydrogen sulfide; Inorganic Chemistry; Metal-organic frameworks; Organic Chemistry; Polymer Sciences; Pressure effects; Temperature effects; Trimesic acid
• ISSN: 1574-1443; 1574-1451
• DOI: 10.1007/s10904-017-0740-4

Metal–organic framework material MOF-199 is a new type of adsorption material for removal toxic H 2 S. In this work, the effects of temperature and pressure on the performance of H 2 S adsorption in MOF-199 were studied by using the grand canonical Monte Carlo (GCMC) simulation; the interaction mechanism between framework atoms of MOF-199 and guest H 2 S molecules were further discussed through density functional theory (DFT) calculations. It is found that the MOF-199 adsorption capacity towards H 2 S decreases with increasing temperature and increases with increasing pressure. At low pressures, the frameworks containing the binding sites of copper dimers and trimesic acid are the main factor affecting the adsorption performance of MOF-199. While at high pressures, the free volume of MOF-199 contributes to the adsorption capacity as well. The adsorptive interactions between H 2 S and the organic ligand are weak (>− 14.469 kJ/mol). When H 2 S adsorption on the Cu–Cu bridge, the binding energies of the modes where hydrogen is put inward of the copper dimer are generally smaller than that where hydrogen is outward, whereas the adsorption on the top of copper ion shows the smallest BEs value (