Evaluation of structural design methodologies for predicting mechanical reliability of solder joint of BGA and TSSOP under launch random vibration excitation

•We propose structural design methodologies of spaceborne electronics.•The methodologies are based on mechanical safety prediction on solder joint.•We performed the fatigue tests of PCB specimens under random vibration.•The effectiveness of the proposed methodologies were validated by the tests. The...

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Bibliographic Details
Published in:International journal of fatigue 2018-09, Vol.114, p.206-216
Main Authors: Park, Tae-Yong, Park, Jong-Chan, Oh, Hyun-Ung
Format: Article
Language:English
Subjects:
Ball grid packaging
Circuit boards
Crack propagation
Damage accumulation
Design analysis
Electronics
Excitation
Fatigue failure
Fatigue life
Fatigue life assessment
Fatigue tests
Materials fatigue
Mechanical reliability
Printed circuits
Random vibration
Reliability analysis
Solder joint
Soldered joints
Soldering
Structural design
Vibration analysis
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Summary:•We propose structural design methodologies of spaceborne electronics.•The methodologies are based on mechanical safety prediction on solder joint.•We performed the fatigue tests of PCB specimens under random vibration.•The effectiveness of the proposed methodologies were validated by the tests. The fatigue damage that accumulates on a solder joint under a launch vibration environment is a major cause of failure in spaceborne electronics. Thus, predicting the mechanical safety of the solder joint in the structural design phase is important to guarantee a successful space mission. This paper proposes a mechanical design methodology to predict and ensure more reliable mechanical safety of the solder joints of a plastic ball grid array (PBGA) and a thin-shrink small outline package (TSSOP) under launch random vibration excitation. Random vibration fatigue tests for a sample printed circuit board (PCB) assembly were performed to assess the fatigue life of BGA and TSSOP solder joints. The effectiveness of the proposed structural design methodologies was evaluated by comparing the margin of safety calculated from various analysis approaches and the random vibration fatigue test results of the PCB specimen.
ISSN:0142-1123
1879-3452
DOI:10.1016/j.ijfatigue.2018.05.012