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Vertical Current Transport in AlGaN/GaN HEMTs on Silicon: Experimental Investigation and Analytical Model
We investigate the vertical leakage mechanism in metal-organic chemical vapor deposition-grown carbon (C)-doped AlGaN/GaN High Electron Mobility Transistors (HEMTs) on 6-in silicon wafer. Substrate bias polarity-dependent {I} - {V}_{s} , temperature-dependent fitting, and band diagram analysis poin...
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Published in: | IEEE transactions on electron devices 2019-01, Vol.66 (1), p.613-618 |
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Main Authors: | , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | We investigate the vertical leakage mechanism in metal-organic chemical vapor deposition-grown carbon (C)-doped AlGaN/GaN High Electron Mobility Transistors (HEMTs) on 6-in silicon wafer. Substrate bias polarity-dependent {I} - {V}_{s} , temperature-dependent fitting, and band diagram analysis pointed to the Poole-Frenkel (P-F) type of conduction mechanism for vertical transport in the devices with breakdown as high as 580 V for a buffer of \textsf {4}~\mu \text{m} . Trap activation energy of 0.61 eV was estimated from the P-F fitting which matches well with values reported in the literature. We propose that higher dislocation density leads to shallower traps in the buffer and build an analytical model of dislocation-mediated vertical leakage around this. The variation in leakage as a function of dislocation density at a given field is predicted and is found to be the most abrupt in the range from \sim 10^{\textsf {7}} to \sim 10^{\textsf {9}} cm ^{-\textsf {2}} of dislocation density. This can be attributed to a sharp decrease in trap activation energy in the above range of dislocation density, possibly due to complex formation between point defects and dislocations. |
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ISSN: | 0018-9383 1557-9646 |
DOI: | 10.1109/TED.2018.2882533 |