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Vertical Current Transport in AlGaN/GaN HEMTs on Silicon: Experimental Investigation and Analytical Model

We investigate the vertical leakage mechanism in metal-organic chemical vapor deposition-grown carbon (C)-doped AlGaN/GaN High Electron Mobility Transistors (HEMTs) on 6-in silicon wafer. Substrate bias polarity-dependent {I} - {V}_{s} , temperature-dependent fitting, and band diagram analysis poin...

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Bibliographic Details
Published in:IEEE transactions on electron devices 2019-01, Vol.66 (1), p.613-618
Main Authors: Remesh, Nayana, Mohan, Nagaboopathy, Kumar, Sandeep, Prabhu, Shreesha, Guiney, Ivor, Humphreys, Colin J., Raghavan, Srinivasan, Muralidharan, Rangarajan, Nath, Digbijoy N.
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Language:English
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Summary:We investigate the vertical leakage mechanism in metal-organic chemical vapor deposition-grown carbon (C)-doped AlGaN/GaN High Electron Mobility Transistors (HEMTs) on 6-in silicon wafer. Substrate bias polarity-dependent {I} - {V}_{s} , temperature-dependent fitting, and band diagram analysis pointed to the Poole-Frenkel (P-F) type of conduction mechanism for vertical transport in the devices with breakdown as high as 580 V for a buffer of \textsf {4}~\mu \text{m} . Trap activation energy of 0.61 eV was estimated from the P-F fitting which matches well with values reported in the literature. We propose that higher dislocation density leads to shallower traps in the buffer and build an analytical model of dislocation-mediated vertical leakage around this. The variation in leakage as a function of dislocation density at a given field is predicted and is found to be the most abrupt in the range from \sim 10^{\textsf {7}} to \sim 10^{\textsf {9}} cm ^{-\textsf {2}} of dislocation density. This can be attributed to a sharp decrease in trap activation energy in the above range of dislocation density, possibly due to complex formation between point defects and dislocations.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2018.2882533