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Effect of the arrangement of the punch units in multi-point stretch forming process
Multi-point stretch forming (MPSF), by replacing the traditional rigid fixed-shape stretching die with the multi-point die (MPD), is an important flexible forming technique in sheet metal forming process. However, the particular dimples will be generated on the formed part surface when forming by MP...
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Published in: | International journal of advanced manufacturing technology 2016-09, Vol.86 (5-8), p.2309-2317 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Multi-point stretch forming (MPSF), by replacing the traditional rigid fixed-shape stretching die with the multi-point die (MPD), is an important flexible forming technique in sheet metal forming process. However, the particular dimples will be generated on the formed part surface when forming by MPD. In this paper, we prove that the dimple formation can be suppressed by changing the punch units of MPD arrangement. Therefore, the forming effect can be largely improved. Spherical parts are selected as the study objects. Under the same loading condition, two MPSF finite element numerical models are established for conventional arrangement multi-point die (CAMPD) and staggered arrangement multi-point die (SAMPD), respectively. Through the numerical simulations and the stretch forming experiments, the stress, strain, thickness, springback, and shape accuracy are compared between the two parts formed by CAMPD and SAMPD. The results show that the values of the stress, strain, thickness thinning rate, and springback of the formed part are smaller when forming by SAMPD. Moreover, the distributions of the stress, strain, and thickness are more uniform. Also, the surface forming quality and the shape accuracy are improved. These results provide a valuable guidance during developing the new types of MPD. |
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ISSN: | 0268-3768 1433-3015 |
DOI: | 10.1007/s00170-016-8367-0 |