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Impact of Intramolecular Hydrogen Bonding on the Reactivity of Cupric Superoxide Complexes with O−H and C−H Substrates
The dioxygen reactivity of a series of TMPA‐based copper(I) complexes (TMPA=tris(2‐pyridylmethyl)amine), with and without secondary‐coordination‐sphere hydrogen‐bonding moieties, was studied at −135 °C in 2‐methyltetrahydrofuran (MeTHF). Kinetic stabilization of the H‐bonded [((X1)(X2) TMPA)CuII(O2....
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Published in: | Angewandte Chemie 2019-12, Vol.131 (49), p.17736-17740 |
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Main Authors: | , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The dioxygen reactivity of a series of TMPA‐based copper(I) complexes (TMPA=tris(2‐pyridylmethyl)amine), with and without secondary‐coordination‐sphere hydrogen‐bonding moieties, was studied at −135 °C in 2‐methyltetrahydrofuran (MeTHF). Kinetic stabilization of the H‐bonded [((X1)(X2)
TMPA)CuII(O2.−)]+ cupric superoxide species was achieved, and they were characterized by resonance Raman (rR) spectroscopy. The structures and physical properties of [((X1)(X2)
TMPA)CuII(N3−)]+ azido analogues were compared, and the O2.− reactivity of ligand–CuI complexes when an H‐bonding moiety is replaced by a methyl group was contrasted. A drastic enhancement in the reactivity of the cupric superoxide towards phenolic substrates as well as oxidation of substrates possessing moderate C−H bond‐dissociation energies is observed, correlating with the number and strength of the H‐bonding groups.
Kleiner Helfer H‐Brücke: Die Disauerstoff‐Reaktivität einer Reihe TMPA‐basierter Cu(I)‐Komplexe (TMPA=Tris(2‐pyridylmethyl)amin) wurde untersucht. Kinetische Stabilisierung der H‐Brücken‐gebundenen Kupfersuperoxid‐Spezies [((X1)(X2)
▪TMPA)CuII(O2.−)]+ wurde mit X1/X2=−NH2 und/oder Pivalamido (−HNC(O)C(CH3)3) erreicht. Die Komplexe zeigen eine hohe Reaktivität gegenüber Phenolsubstraten und Substraten mit moderaten C‐H‐Bindungsdissoziationsenergien. |
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ISSN: | 0044-8249 1521-3757 |
DOI: | 10.1002/ange.201908471 |