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Highly ductile glassy epoxy systems obtained by network topology modification using partially reacted substructures

A strategy for toughening epoxy thermosets via topological rearrangement of cross-linked networks is presented. Amine-cured epoxy systems were modified by mixing partially reacted substructures (mPRS), which were synthesized by partially curing tetraglycidyl ether of diaminodiphenylmethane (TGDDM) a...

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Bibliographic Details
Published in:Polymer (Guilford) 2021-01, Vol.212, p.123260, Article 123260
Main Authors: Gao, J., Chu, X., Henry, C.K., Santos, S.C., Palmese, G.R.
Format: Article
Language:English
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Summary:A strategy for toughening epoxy thermosets via topological rearrangement of cross-linked networks is presented. Amine-cured epoxy systems were modified by mixing partially reacted substructures (mPRS), which were synthesized by partially curing tetraglycidyl ether of diaminodiphenylmethane (TGDDM) and polyether monoamine (Jeffamine M1000) to provide free unbound surfaces that enhance protovoid formation during deformation. The influence of mPRS conversion and weight ratio on the properties of diglycidyl ether of bisphenol A (DGEBA) and TGDDM systems cured with Jeffamine D230 was investigated. Adding mPRS resulted in high Tg systems capable of exceptional strain at failure in tension: 43% for the DGEBA (Tg = 75 °C) and 20% for the TGDDM (Tg = 135 °C). The addition of mPRS, however, decreases Tg relative to unmodified systems. SEM and SAXS characterization provide evidence of protovoid (18–34 nm) formation. Quasi-static compressive tests conducted at testing temperatures selected to maintain a constant (Tg - Ttest) reveal the protovoid opening mechanism plays a dominant role in enhanced ductility. [Display omitted] •Control of network topology was used to toughen cross-linked epoxy systems.•Partially reacted substructures based on long-chain monoamines (mPRS) were used.•Epoxies networks with exceptional ductility were created.•Failure tensile strain up to 43% for DGEBA epoxies (Tg = 75 °C) was achieved.•Failure tensile strain up tp 20% for TGDDM (Tg = 135 °C) was obtained.
ISSN:0032-3861
1873-2291
DOI:10.1016/j.polymer.2020.123260