A review of heat pipe technology for foldable electronic devices

•A review of the current state-of-the-art heat pipe technology for foldable electronics.•Article divides previous research depending on their thickness and flexibility.•Thermal performance, novel manufacturing processes, open questions, and future directions are discussed. The advent of foldable and...

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Bibliographic Details
Published in:Applied thermal engineering 2021-07, Vol.194, p.117087, Article 117087
Main Authors: Gibbons, Michael J., Marengo, Marco, Persoons, Tim
Format: Article
Language:English
Subjects:
Electronic cooling
Electronic devices
Electronics
Flexible heat pipe
Heat pipes
Heat transfer
Microprocessors
Pipes
Smartphones
State-of-the-art reviews
Thermal ground plane
Thermal management
Thermal spreader
Vapor chamber
Wearable technology
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Summary:•A review of the current state-of-the-art heat pipe technology for foldable electronics.•Article divides previous research depending on their thickness and flexibility.•Thermal performance, novel manufacturing processes, open questions, and future directions are discussed. The advent of foldable and wearable devices, such as the Samsung Galaxy Fold (2019) and Huawei Mate X (2019), require increased battery size and processor performance to drive their larger flexible displays. There is a growing need to develop flexible thermal management solutions to cool these foldable electronic devices. This research presents a comprehensive review of the state-of-the-art for both rigid and flexible ultra-thin heat pipe technology. This review discusses various types of heat pipes, their thermal performance, novel manufacturing processes, and the open research questions, challenges, together with the potential future directions of this research area.
ISSN:1359-4311
1873-5606
DOI:10.1016/j.applthermaleng.2021.117087