An enhanced centrifuge-based approach to powder characterization: The interaction between particle roughness and particle-scale surface topography described by a size-dependent ‘effective’ Hamaker constant

Many industries process and manufacture powders and have to account for powder adhesion. Therefore, tools that predict powder behavior based on particle scale measurements are beneficial to industry. Simulations of the centrifuge technique, utilizing substrates with hemispherical indentations, were...

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Bibliographic Details
Published in:Powder technology 2021-10, Vol.391, p.198-205
Main Authors: Stevenson, Caralyn A., Thomas, Myles C., Beaudoin, Stephen P.
Format: Article
Language:English
Subjects:
Adhesion
Centrifuge technique
Centrifuges
Indentation
Particle adhesion
Powder
Powder characterization
Simulation
Spherical powders
Substrates
Surface element integration
Surface roughness
Surface roughness effects
Topography
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Summary:Many industries process and manufacture powders and have to account for powder adhesion. Therefore, tools that predict powder behavior based on particle scale measurements are beneficial to industry. Simulations of the centrifuge technique, utilizing substrates with hemispherical indentations, were performed to extend the powder characterization capabilities of the technique. These simulations used a simulated rough powder, modeled as spheres with sinusoidal topography, to determine the percentage of particles remaining as a function of centrifuge rotational speed, indentation size, and particle size. It was discovered that an equivalent powder of smooth spherical particles could be used to describe the adhesion behavior of the rough powder by establishing a size-dependent effective Hamaker constant distribution. This development made it possible to describe the surface roughness effects of the powder through one adjustable distributed parameter. These results demonstrate the capability of the enhanced centrifuge technique for advanced powder characterization. [Display omitted] •Simulations of the centrifuge technique were performed with designed substrates.•The effect of surface roughness on particle adhesion was investigated.•Roughness effects were described by an effective Hamaker constant distribution.•An equivalent smooth powder described the adhesion behavior of a rough powder.
ISSN:0032-5910
1873-328X
DOI:10.1016/j.powtec.2021.06.006