The electronic component authenticity verification

The article presents a brief insight into the university research of efficient methods aimed at revealing counterfeit electronic components. Methods like multichannel curve tracing, component internal structure X-raying, system on chip optical inspection with higher magnification microscopy and Scan...

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Published in:Journal of physics. Conference series 2018-08, Vol.1065 (10), p.102014
Main Authors: Neumann, P, Navrátil, M, Pospíšilík, M, Křesálek, V, Adámek, M
Format: Article
Language:English
Subjects:
Counterfeit
Electronic components
Inspection
Microscopy
Physics
System on chip
Verification
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container_issue 10
container_start_page 102014
container_title Journal of physics. Conference series
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creator Neumann, P
Navrátil, M
Pospíšilík, M
Křesálek, V
Adámek, M
description The article presents a brief insight into the university research of efficient methods aimed at revealing counterfeit electronic components. Methods like multichannel curve tracing, component internal structure X-raying, system on chip optical inspection with higher magnification microscopy and Scanning Electron Microscopy combined with Element Energy Dispersive Spectroscopy (EDS) are powerful means for authenticity verification. Comparative analysis results serve as an illustration of cases where various features differences can warn not to let a particular component delivery penetrate the assembly process.
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fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2572717763</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2572717763</sourcerecordid><originalsourceid>FETCH-LOGICAL-c3334-a33ea1b4c101f52579a3c286c47818914fc6ee999bfb2f374dd4c7bf33db965c3</originalsourceid><addsrcrecordid>eNqFkF1LwzAUhoMoOKf_oeCl1OWr-biUok4ZKDivQ5omLGNratoK-_emVCaIYDjkHJLnvIfzApAheIugEAvEKc5ZIdkCQVakKwWGiJ6A2fHr9FgLcQ4uum4LIUmHzwBeb2xmd9b0MTTeZCbs29DYps_00G9S9sb3h-zTRu-80b0PzSU4c3rX2avvPAfvD_frcpmvXh6fyrtVbpI0zTUhVqOKGgSRK3DBpSYGC2YoF0hIRJ1h1kopK1dhRzita2p45QipK8kKQ-bgetJtY_gYbNerbRhik0aqpIY54pyRRImJMjF0XbROtdHvdTwoBNXokBpXV6MNanRoeh4dSq03U6sP7Y_282v59otUbe0STf-g_x3yBeqAdXo</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2572717763</pqid></control><display><type>article</type><title>The electronic component authenticity verification</title><source>Publicly Available Content (ProQuest)</source><source>Free Full-Text Journals in Chemistry</source><creator>Neumann, P ; Navrátil, M ; Pospíšilík, M ; Křesálek, V ; Adámek, M</creator><creatorcontrib>Neumann, P ; Navrátil, M ; Pospíšilík, M ; Křesálek, V ; Adámek, M</creatorcontrib><description>The article presents a brief insight into the university research of efficient methods aimed at revealing counterfeit electronic components. Methods like multichannel curve tracing, component internal structure X-raying, system on chip optical inspection with higher magnification microscopy and Scanning Electron Microscopy combined with Element Energy Dispersive Spectroscopy (EDS) are powerful means for authenticity verification. Comparative analysis results serve as an illustration of cases where various features differences can warn not to let a particular component delivery penetrate the assembly process.</description><identifier>ISSN: 1742-6588</identifier><identifier>EISSN: 1742-6596</identifier><identifier>DOI: 10.1088/1742-6596/1065/10/102014</identifier><language>eng</language><publisher>Bristol: IOP Publishing</publisher><subject>Counterfeit ; Electronic components ; Inspection ; Microscopy ; Physics ; System on chip ; Verification</subject><ispartof>Journal of physics. Conference series, 2018-08, Vol.1065 (10), p.102014</ispartof><rights>Published under licence by IOP Publishing Ltd</rights><rights>2018. This work is published under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c3334-a33ea1b4c101f52579a3c286c47818914fc6ee999bfb2f374dd4c7bf33db965c3</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.proquest.com/docview/2572717763?pq-origsite=primo$$EHTML$$P50$$Gproquest$$Hfree_for_read</linktohtml><link.rule.ids>314,776,780,25731,27901,27902,36989,44566</link.rule.ids></links><search><creatorcontrib>Neumann, P</creatorcontrib><creatorcontrib>Navrátil, M</creatorcontrib><creatorcontrib>Pospíšilík, M</creatorcontrib><creatorcontrib>Křesálek, V</creatorcontrib><creatorcontrib>Adámek, M</creatorcontrib><title>The electronic component authenticity verification</title><title>Journal of physics. Conference series</title><addtitle>J. Phys.: Conf. Ser</addtitle><description>The article presents a brief insight into the university research of efficient methods aimed at revealing counterfeit electronic components. Methods like multichannel curve tracing, component internal structure X-raying, system on chip optical inspection with higher magnification microscopy and Scanning Electron Microscopy combined with Element Energy Dispersive Spectroscopy (EDS) are powerful means for authenticity verification. Comparative analysis results serve as an illustration of cases where various features differences can warn not to let a particular component delivery penetrate the assembly process.</description><subject>Counterfeit</subject><subject>Electronic components</subject><subject>Inspection</subject><subject>Microscopy</subject><subject>Physics</subject><subject>System on chip</subject><subject>Verification</subject><issn>1742-6588</issn><issn>1742-6596</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><sourceid>PIMPY</sourceid><recordid>eNqFkF1LwzAUhoMoOKf_oeCl1OWr-biUok4ZKDivQ5omLGNratoK-_emVCaIYDjkHJLnvIfzApAheIugEAvEKc5ZIdkCQVakKwWGiJ6A2fHr9FgLcQ4uum4LIUmHzwBeb2xmd9b0MTTeZCbs29DYps_00G9S9sb3h-zTRu-80b0PzSU4c3rX2avvPAfvD_frcpmvXh6fyrtVbpI0zTUhVqOKGgSRK3DBpSYGC2YoF0hIRJ1h1kopK1dhRzita2p45QipK8kKQ-bgetJtY_gYbNerbRhik0aqpIY54pyRRImJMjF0XbROtdHvdTwoBNXokBpXV6MNanRoeh4dSq03U6sP7Y_282v59otUbe0STf-g_x3yBeqAdXo</recordid><startdate>20180801</startdate><enddate>20180801</enddate><creator>Neumann, P</creator><creator>Navrátil, M</creator><creator>Pospíšilík, M</creator><creator>Křesálek, V</creator><creator>Adámek, M</creator><general>IOP Publishing</general><scope>O3W</scope><scope>TSCCA</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>H8D</scope><scope>HCIFZ</scope><scope>L7M</scope><scope>P5Z</scope><scope>P62</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope></search><sort><creationdate>20180801</creationdate><title>The electronic component authenticity verification</title><author>Neumann, P ; Navrátil, M ; Pospíšilík, M ; Křesálek, V ; Adámek, M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3334-a33ea1b4c101f52579a3c286c47818914fc6ee999bfb2f374dd4c7bf33db965c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Counterfeit</topic><topic>Electronic components</topic><topic>Inspection</topic><topic>Microscopy</topic><topic>Physics</topic><topic>System on chip</topic><topic>Verification</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Neumann, P</creatorcontrib><creatorcontrib>Navrátil, M</creatorcontrib><creatorcontrib>Pospíšilík, M</creatorcontrib><creatorcontrib>Křesálek, V</creatorcontrib><creatorcontrib>Adámek, M</creatorcontrib><collection>Open Access: IOP Publishing Free Content</collection><collection>IOPscience (Open Access)</collection><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni)</collection><collection>ProQuest Central</collection><collection>Advanced Technologies &amp; Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central</collection><collection>Aerospace Database</collection><collection>SciTech Premium Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ProQuest advanced technologies &amp; aerospace journals</collection><collection>ProQuest Advanced Technologies &amp; Aerospace Collection</collection><collection>Publicly Available Content (ProQuest)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><jtitle>Journal of physics. Conference series</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Neumann, P</au><au>Navrátil, M</au><au>Pospíšilík, M</au><au>Křesálek, V</au><au>Adámek, M</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The electronic component authenticity verification</atitle><jtitle>Journal of physics. Conference series</jtitle><addtitle>J. Phys.: Conf. Ser</addtitle><date>2018-08-01</date><risdate>2018</risdate><volume>1065</volume><issue>10</issue><spage>102014</spage><pages>102014-</pages><issn>1742-6588</issn><eissn>1742-6596</eissn><abstract>The article presents a brief insight into the university research of efficient methods aimed at revealing counterfeit electronic components. Methods like multichannel curve tracing, component internal structure X-raying, system on chip optical inspection with higher magnification microscopy and Scanning Electron Microscopy combined with Element Energy Dispersive Spectroscopy (EDS) are powerful means for authenticity verification. Comparative analysis results serve as an illustration of cases where various features differences can warn not to let a particular component delivery penetrate the assembly process.</abstract><cop>Bristol</cop><pub>IOP Publishing</pub><doi>10.1088/1742-6596/1065/10/102014</doi><tpages>4</tpages><oa>free_for_read</oa></addata></record>
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source Publicly Available Content (ProQuest); Free Full-Text Journals in Chemistry
subjects Counterfeit
Electronic components
Inspection
Microscopy
Physics
System on chip
Verification
title The electronic component authenticity verification
url http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T23%3A53%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=The%20electronic%20component%20authenticity%20verification&rft.jtitle=Journal%20of%20physics.%20Conference%20series&rft.au=Neumann,%20P&rft.date=2018-08-01&rft.volume=1065&rft.issue=10&rft.spage=102014&rft.pages=102014-&rft.issn=1742-6588&rft.eissn=1742-6596&rft_id=info:doi/10.1088/1742-6596/1065/10/102014&rft_dat=%3Cproquest_cross%3E2572717763%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c3334-a33ea1b4c101f52579a3c286c47818914fc6ee999bfb2f374dd4c7bf33db965c3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=2572717763&rft_id=info:pmid/&rfr_iscdi=true