Thermal Modeling of Rapid Single Flux Quantum Circuit Structures

The operation of rapid single flux quantum (RSFQ) circuits depends upon the superconductive properties of the Josephson junctions (JJs) and metal layers, which are highly dependent on the temperature. Increasing densities and frequencies of JJs in RSFQ circuits have created a need to accurately mode...

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Bibliographic Details
Published in:IEEE transactions on electron devices 2022-05, Vol.69 (5), p.2718-2724
Main Authors: Mitrovic, Ana, Friedman, Eby G.
Format: Article
Language:English
Subjects:
Circuits
Computational modeling
Conductivity
Heat generation
Integrated circuit modeling
Josephson junctions
Resistance heating
Resistors
Single flux quantum (SFQ)
superconducting integrated circuits
superconductive digital electronics
Superconductivity
Superconductors
Temperature dependence
Temperature effects
Thermal analysis
Thermal environments
Thermal resistance
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Summary:The operation of rapid single flux quantum (RSFQ) circuits depends upon the superconductive properties of the Josephson junctions (JJs) and metal layers, which are highly dependent on the temperature. Increasing densities and frequencies of JJs in RSFQ circuits have created a need to accurately model the local ambient thermal environment. In this article, an analytic thermal model of RSFQ circuit structures targeting the MIT Lincoln Laboratory SFQ5ee 10 kA/cm 2 technology is presented. The model is based on a network of thermal resistances, representing the heat generation and thermal paths within an RSFQ circuit. An error of less than 0.22% between the model and a numerical solver is achieved. To reduce the computational complexity, the sparsity of the matrix of thermal resistances among the nodes is increased by exploiting the effective radius of the heat spreading behavior. Ignoring the thermal effects of the heating elements outside of a target radius reduces the number of thermal resistances by 50%, increasing the maximum error of the model to only 0.26%.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2022.3162172