Simulation of Reacting, Moving Granular Assemblies of Thermally Thick Particles by Discrete Element Method/Computational Fluid Dynamics

The potential and limitations of the discrete element method (DEM) coupled with computational fluid mechanics (CFD) to simulate chemically reacting, moving granular material interacting with a fluid flow are summarized. A special focus is set on thermally thick particles, which requires to resolve t...

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Bibliographic Details
Published in:Chemical engineering & technology 2023-07, Vol.46 (7), p.1317-1332
Main Authors: Mahiques, Enric Illana, Brömmer, Maximilian, Wirtz, Siegmar, Wachem, Berend, Scherer, Viktor
Format: Article
Language:English
Subjects:
Assemblies
Chemical reactions
Computational fluid dynamics
Contact force
Discrete element method
Fluid flow
Fluid mechanics
Granular assemblies
Granular materials
Particle shape
Thermally thick particles
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Summary:The potential and limitations of the discrete element method (DEM) coupled with computational fluid mechanics (CFD) to simulate chemically reacting, moving granular material interacting with a fluid flow are summarized. A special focus is set on thermally thick particles, which requires to resolve the intraparticle transport and reaction processes. The aspect of complex particle shape is addressed, as shape may dominate the particle behavior in densely packed granular assemblies even more than the details of contact force laws. The fluid flow in the granular assembly is assumed to be a gas. The potential of DEM/CFD will be highlighted presenting three illustrative examples: a large‐scale lime shaft kiln with intermittent operation, an industrial‐size grate firing system for the incineration of municipal waste, and a small‐scale straw pellet stove. Simulations of particle assemblies passed by a reacting flow are possible due to the discrete element method (DEM) coupled with computational fluid dynamics. The relevant models required for DEM in terms of particle shape representation, mechanic/thermal interactions, and intraparticle resolution are described. Three systems on very different applications are simulated for an insight of the physical processes.
ISSN:0930-7516
1521-4125
DOI:10.1002/ceat.202200520