Loading…
Attaining synergetic equilibrium of electrical conductivity and tensile strength in GQDs@GN/Cu composites through multi-scale intragranular and intergranular reinforcements
The configuration and quality of reinforcements, as well as the robustness of interfacial bonding, holding a critical significance in determining the concurrence between electrical conductivity and mechanical strength in metal matrix composites. In this study, citric acid was employed as the precurs...
Saved in:
Published in: | Rare metals 2024, Vol.43 (1), p.366-379 |
---|---|
Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | The configuration and quality of reinforcements, as well as the robustness of interfacial bonding, holding a critical significance in determining the concurrence between electrical conductivity and mechanical strength in metal matrix composites. In this study, citric acid was employed as the precursor for synthesizing multi-scale carbon nanomaterials (graphene quantum dots and graphene, abbreviated as GQDs and GN). The GQDs@GN/Cu composites were fabricated through a segmented ball milling process in conjunction with subsequent spark plasma sintering (SPS). The intragranular GQDs and intergranular GQDs@GN had synergistically reinforced Cu composites through Orowan strengthening, load transfer strengthening and refinement strengthening. Furthermore, the robust interface bonding between GQDs@GN and Cu effectively mitigated interfacial impedance stemming from electron-boundary scattering. The yield strength and ultimate tensile strength of the GQDs@GN/Cu composites were recorded as 270 and 314 MPa, respectively, representing an improvement of 92 and 28% over pure Cu, while maintaining electrical conductivity at a level comparable to that of pure Cu. This study advances the understanding of the possibility of realizing a synergistic compatibility between electrical conductivity and mechanical strength in Cu composites.
Graphical abstract |
---|---|
ISSN: | 1001-0521 1867-7185 |
DOI: | 10.1007/s12598-023-02391-0 |