Loading…

Attaining synergetic equilibrium of electrical conductivity and tensile strength in GQDs@GN/Cu composites through multi-scale intragranular and intergranular reinforcements

The configuration and quality of reinforcements, as well as the robustness of interfacial bonding, holding a critical significance in determining the concurrence between electrical conductivity and mechanical strength in metal matrix composites. In this study, citric acid was employed as the precurs...

Full description

Saved in:
Bibliographic Details
Published in:Rare metals 2024, Vol.43 (1), p.366-379
Main Authors: Zhang, Shuang-Yin, Liu, Liang, Bao, Rui, Yi, Jian-Hong, Guo, Sheng-Da
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The configuration and quality of reinforcements, as well as the robustness of interfacial bonding, holding a critical significance in determining the concurrence between electrical conductivity and mechanical strength in metal matrix composites. In this study, citric acid was employed as the precursor for synthesizing multi-scale carbon nanomaterials (graphene quantum dots and graphene, abbreviated as GQDs and GN). The GQDs@GN/Cu composites were fabricated through a segmented ball milling process in conjunction with subsequent spark plasma sintering (SPS). The intragranular GQDs and intergranular GQDs@GN had synergistically reinforced Cu composites through Orowan strengthening, load transfer strengthening and refinement strengthening. Furthermore, the robust interface bonding between GQDs@GN and Cu effectively mitigated interfacial impedance stemming from electron-boundary scattering. The yield strength and ultimate tensile strength of the GQDs@GN/Cu composites were recorded as 270 and 314 MPa, respectively, representing an improvement of 92 and 28% over pure Cu, while maintaining electrical conductivity at a level comparable to that of pure Cu. This study advances the understanding of the possibility of realizing a synergistic compatibility between electrical conductivity and mechanical strength in Cu composites. Graphical abstract
ISSN:1001-0521
1867-7185
DOI:10.1007/s12598-023-02391-0