Experimental study of the removal characteristics of C/SiC with different fiber structure arrangements for two-dimensional ultrasound-assisted grinding

• Published in: International journal of advanced manufacturing technology 2024-04, Vol.131 (7-8), p.3467-3485
• Main Authors: Wang, Yashuai, Li, Jiangtao
• Format: Article
• Language: English
• Subjects: CAE) and Design; Carbon-silicon carbide composites; Computer-Aided Engineering (CAD; Diamond machining; Engineering; Fiber orientation; Grinding; Industrial and Production Engineering; Mechanical Engineering; Media Management; Orientation effects; Original Article; Precision machining; Reduction; Surface properties; Surface roughness; Ultrasonic imaging
• ISSN: 0268-3768; 1433-3015
• DOI: 10.1007/s00170-024-13138-1

Ultrasound-assisted grinding is a new method for compound precision machining of C/SiC with excellent machining characteristics. The electroplated diamond grinding head performs a two-dimensional ultrasonic auxiliary plane grinding single-factor experiment for SiC, 2.5D-C/SiC, and chopped fiber-C/SiC. The influences of linear speed, feed speed, grinding depth, fiber orientation, and fiber structure on the grinding force and surface quality are analyzed in this study. The surface formation and removal mechanisms of C/SiC composites are discussed. The results show that within the parameters of this experiment, the grinding force and surface roughness decrease with the increase in linear speed and increase with the increase in feed speed and grinding depth. The grinding force and roughness can be significantly reduced by applying two-dimensional ultrasound. The maximum percentage reduction in normal and tangential grinding forces was 26.79% and 31.69% when grinding 2.5D-C/SiC along 90° fiber orientation. The maximum percentage of surface roughness reduction was 37.93% when 2.5D-C/SiC was ground along a 90° fiber orientation. The influence of fiber orientation on the two types of C/SiC grinding force is the same, and both are satisfied that the grinding force is highest in the 45° fiber orientation, second highest in the 90° fiber orientation, and lowest in the 0° fiber orientation. The effect of fiber orientation on the roughness of 2.5D-C/SiC is as follows: the surface roughness is highest at 45° fiber orientation, second highest at 90° fiber orientation, and lowest at 0° fiber orientation. The effect of fiber orientation on the roughness of short-cut fiber-C/SiC is as follows: the surface roughness is highest at 0° fiber orientation, second highest at 45° fiber orientation, and lowest at 90° fiber orientation. The effect of fiber structure on grinding force is as follows: Under the same machining conditions, the grinding forces are highest on SiC, second highest on short-cut fiber-C/SiC, and lowest on 2.5D-C/SiC. The effect of fiber structure on surface roughness is as follows: Under the same machining conditions, the surface roughness is highest on short-cut fiber-C/SiC, second highest on 2.5D-C/SiC, and lowest on SiC.