Investigate the mechanical properties of Cu-SiO2 nanocomposite via powder metallurgy

• Published in: Hyperfine interactions 2024-07, Vol.245 (1)
• Main Authors: Piramanayagam, P., Srividhya, N., Tharisanan, R. Theerkka, Maran, M., Vijayakumar, M.
• Format: Article
• Language: English
• Subjects: Abrasion resistance; Abrasive wear; Ammonia; Atomic; Compressive strength; Condensed Matter Physics; Copper; Density; Electrical resistivity; Hadrons; Hardness; Heavy Ions; Mechanical properties; Molecular; Nanocomposites; Nuclear Physics; Optical and Plasma Physics; Particulate composites; Physics; Physics and Astronomy; Powder metallurgy; Silicon dioxide; Sintering (powder metallurgy); Surfaces and Interfaces; Thin Films; Wear resistance
• ISSN: 0304-3843; 3005-0731; 1572-9540
• DOI: 10.1007/s10751-024-01975-1

The paper proposed the methodology for research findings on developing a Cu-SiO 2 sintered composite produced by powder metallurgy. In a copper matrix, SiO 2 particles were added in concentrations of 5%, 7.5%and 10%. Mixtures of finished powders were pressed with a crushing pressure of 620 MPa using a single press and then applied to sintering processes in the dissociated ammonia atmosphere at 910 °C. It was 65 min for sintering. Sintered compact specimens were tested for electrical conductivity, wear resistance, density and hardness. A composite comprising 5% SiO 2 , which was 7.94 g/cm 3 , obtained the maximum density. A composite with 10% SiO 2 corresponds to 50 HB, and the maximum hardness was achieved. The highest electrical conductivity was 59 MS/m for the composite containing 5% SiO 2 . The greater abrasive wear resistance strength was achieved by 10% SiO 2 composite. Along with the rise of composite SiO2, the density and electric conductivity have decreased.