Optimizing thermal and dielectric properties of ethylene-tetrafluoroethylene (ETFE)/h-BN composites via interface engineering: activation of C–F bonds on ETFE for surface grafting

With the increasing demand for dielectric materials in high-frequency microwave applications, fluoropolymer-based dielectric materials have been widely utilized due to their excellent dielectric and insulation properties. However, the low thermal conductivity limits their ability to meet the thermal...

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Bibliographic Details
Published in:Journal of materials chemistry. A, Materials for energy and sustainability Materials for energy and sustainability, 2024-11, Vol.12 (45), p.31424-31431
Main Authors: Wang, Miao, He, Yijin, Yang, Xiaoyu, Hou, Xuhui, Li, Wenxuan, Tan, Shaobo, Zhang, Zhicheng
Format: Article
Language:English
Subjects:
Circuit boards
Composite materials
Dielectric constant
Dielectric loss
Dielectric properties
Dielectrics
Electrical properties
Ethylene
Ethylene tetrafluoroethylenes
Fillers
Fluoropolymers
Graft copolymers
Heat conductivity
Heat transfer
Insulation
Polymers
Segments
Signal transmission
Tetrafluoroethylene
Thermal conductivity
Thermal properties
Thermodynamic properties
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