Non-Fourier heat conduction induced thermal shock fracture behavior of multi-crack auxetic honeycomb structures

The investigation of non-Fourier thermal shock fracture behavior in multi-crack auxetic honeycomb structures (HSs) is presented. By employing a non-Fourier heat conduction model, the corresponding temperature and thermal stress fields are established. Subsequently, a thermal stress intensity factor...

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Bibliographic Details
Published in:Applied mathematics and mechanics 2024, Vol.45 (12), p.2093-2112
Main Authors: Hu, Junsong, Wang, Baoling, Yang, Yang, Xie, Dong
Format: Article
Language:English
Subjects:
Applications of Mathematics
Classical Mechanics
Conduction heating
Conduction model
Conductive heat transfer
Critical temperature
Fluid- and Aerodynamics
Honeycomb structures
Mathematical Modeling and Industrial Mathematics
Mathematics
Mathematics and Statistics
Partial Differential Equations
Shock resistance
Stress distribution
Stress intensity factors
Thermal resistance
Thermal shock
Thermal stress
Transition temperature
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Summary:The investigation of non-Fourier thermal shock fracture behavior in multi-crack auxetic honeycomb structures (HSs) is presented. By employing a non-Fourier heat conduction model, the corresponding temperature and thermal stress fields are established. Subsequently, a thermal stress intensity factor (TSIF) model for the auxetic HSs, accounting for multi-crack interactions, is developed. Finally, using the fracture-based failure criterion, the non-Fourier multi-crack critical temperature of the auxetic HSs is determined. This investigation thoroughly examines the effects of the non-Fourier effect (NFE), auxetic property, crack spacing, and crack location on the thermal shock fracture behavior of the auxetic HSs. Results indicate that a stronger NFE leads to weaker thermal shock resistance in auxetic HSs. Regardless of the presence of the NFE, the auxetic property consistently increases the multi-crack critical temperature of the HSs. Additionally, the interaction of multi-crack inhibits thermal shock crack propagation in HSs.
ISSN:0253-4827
1573-2754
DOI:10.1007/s10483-024-3192-7