Crystalline silicon tilting mirrors for optical cross-connect switches

This paper discusses a two-piece approach for fabricating two-dimensional (2-D) arrays of tilting MEMS mirrors with application in very-large optical cross-connect switches. In the new process, a two-sided etching of silicon-on-insulator (SOI) wafers is used to create crystalline mirrors on a first...

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Bibliographic Details
Published in:Journal of microelectromechanical systems 2003-10, Vol.12 (5), p.708-712
Main Authors: Greywall, D.S., Busch, P.A., Pardo, F., Carr, D.W., Bogart, G., Soh, H.T.
Format: Article
Language:English
Subjects:
Applied sciences
Arrays
Bonding
Circuit properties
Crystal structure
Crystallization
Electric, optical and optoelectronic circuits
Electrodes
Electronics
Etching
Exact sciences and technology
Fabrication techniques
lithography, pattern transfer
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Integrated optics. Optical fibers and wave guides
Mechanical instruments, equipment and techniques
Microelectromechanical systems
Micromechanical devices
Micromechanical devices and systems
Mirrors
Optical and optoelectronic circuits
Optical arrays
Optical switches
Physics
Silicon on insulator technology
Switches
Two dimensional displays
Wafer bonding
Wafers
Wire
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Summary:This paper discusses a two-piece approach for fabricating two-dimensional (2-D) arrays of tilting MEMS mirrors with application in very-large optical cross-connect switches. In the new process, a two-sided etching of silicon-on-insulator (SOI) wafers is used to create crystalline mirrors on a first wafer that is later aligned and bonded to a separate wafer containing the activation electrodes, traces, and bond pads. The approach allows a very close spacing of mirror elements and a very simple design for the mechanical structures, and also greatly simplifies wire routing.
ISSN:1057-7157
1941-0158
DOI:10.1109/JMEMS.2003.818067