Loading…

A wafer-scale membrane transfer Process for the fabrication of optical quality, large continuous membranes

This paper describes a new fabrication technique developed for the construction of large area mirror membranes via the transfer of wafer-scale continuous membranes from one substrate to another. Using this technique, wafer-scale silicon mirror membranes have been successfully transferred without the...

Full description

Saved in:
Bibliographic Details
Published in:Journal of microelectromechanical systems 2003-12, Vol.12 (6), p.804-815
Main Authors: Eui-Hyeok Yang, Wiberg, D.V.
Format: Article
Language:English
Subjects:
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper describes a new fabrication technique developed for the construction of large area mirror membranes via the transfer of wafer-scale continuous membranes from one substrate to another. Using this technique, wafer-scale silicon mirror membranes have been successfully transferred without the use of sacrificial layers such as adhesives or polymers. This transfer technique has also been applied to the fabrication and transfer of 1 /spl mu/m thick corrugated membrane actuators. These membrane actuators consist of several concentric-ring-type corrugations constructed within a polysilicon membrane. A typical polysilicon actuator membrane with an electrode gap of 1.5 /spl mu/m, fabricated using the wafer-scale transfer technique, shows a vertical deflection of 0.4 /spl mu/m at 55 V. The mirror membranes are constructed from single-crystal silicon, 10 cm in diameter, and have been successfully transferred in their entirety. Using a white-light interferometer, the measured average peak-to-valley surface figure error for the transferred single-crystal silicon mirror membranes is approximately 9 nm as measured over a 1 mm/sup 2/ membrane area. The wafer-scale membrane transfer technique demonstrated in this paper has the following benefits over previously reported transfer techniques: 1) No postassembly release process to remove sacrificial polymers is required. 2) The bonded interface is completely isolated from any acid, etchant, or solvent during the transfer process, ensuring a clean and uniform membrane surface. 3) Our technique is capable of transferring large, continuous membranes onto substrates.
ISSN:1057-7157
1941-0158
DOI:10.1109/JMEMS.2003.818454