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Stress-enhanced dislocation density reduction in multicrystalline silicon

Stress is generally perceived to be detrimental for multicrystalline silicon (mc‐Si), leading to dislocation multiplication during crystal growth and processing. Herein, we evaluate the role of stress as a driving force for dislocation density reduction in mc‐Si. At high temperatures, close to the m...

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Published in:Physica status solidi. PSS-RRL. Rapid research letters 2011-01, Vol.5 (1), p.28-30
Main Authors: Bertoni, M. I., Powell, D. M., Vogl, M. L., Castellanos, S., Fecych, A., Buonassisi, T.
Format: Article
Language:English
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Summary:Stress is generally perceived to be detrimental for multicrystalline silicon (mc‐Si), leading to dislocation multiplication during crystal growth and processing. Herein, we evaluate the role of stress as a driving force for dislocation density reduction in mc‐Si. At high temperatures, close to the melting point (>0.8Tm), we observe that the application of stress as well as the relief of residual stress, can modify the density of pre‐existing dislocations in as‐grown mc‐Si under certain conditions, leading to a net local reduction of dislocation density. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim) This Letter demonstrates that stress plays a role in changing the local pre‐exisiting dislocation density in multicrystalline silicon (mc‐Si) at high temperatures. In samples with pre‐existing dislocations, a high‐temperature annealing in combination with large local stresses is observed to increase the local dislocation density, while small stresses – from applied loads or residual stress – lead to a significant reduction. It is concluded that stress should be viewed as an engineering tool to manipulate the local densities of dislocations in mc‐Si, either during crystal growth or in a re‐annealing step.
ISSN:1862-6254
1862-6270
1862-6270
DOI:10.1002/pssr.201004344