Experimental study of bump void formation according to process conditions

► Void formation reduced with decreasing SRO. ► Void area ratio reduced with decreasing SRO. ► Voids were formed in the form of double-walled and ball shape. ► Void generation by the entrapment of flux in the molten solder. Experimental studies of void formation were performed using a solder paste w...

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Bibliographic Details
Published in:Microelectronics and reliability 2013-04, Vol.53 (4), p.638-644
Main Authors: Na, Seong-Hun, Lim, Seung-Kyu, Kim, Jin-Soo, Park, Hwa-Sun, Oh, Heung-Jae, Choi, Jin-Won, Suh, Su-Jeong
Format: Article
Language:English
Subjects:
Applied sciences
Cross-disciplinary physics: materials science
rheology
Design. Technologies. Operation analysis. Testing
Electrodeposition, electroplating
Electronics
Exact sciences and technology
Finishes
Integrated circuits
Materials science
Methods of deposition of films and coatings
film growth and epitaxy
Microelectronic fabrication (materials and surfaces technology)
Palladium
Particle size
Pastes
Physics
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Short range order
Solderability
Solders
Voids
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Summary:► Void formation reduced with decreasing SRO. ► Void area ratio reduced with decreasing SRO. ► Voids were formed in the form of double-walled and ball shape. ► Void generation by the entrapment of flux in the molten solder. Experimental studies of void formation were performed using a solder paste with a small particle size and a thin substrate with a small solder resist opening (SRO) size. Two kinds of Sn–Ag–Cu solder paste, screen printing mask opening (MO) size and pad finishes, and three kinds of SRO sizes were used as process variables. In this study, paste type and MO size had little influence on the formation of voids. In general, fewer voids were formed using the electroless nickel electroless palladium immersion gold (ENEPIG) pad finish than the organic solderability preservative (OSP) pad finish. However, the suitability of the pad finish was different depending on the type of paste. Void formation reduced with decreasing SRO. Both focused ion beam cross-sectioning and a thermal video system were used to ascertain the mechanism of void formation when using the paste with a small particle size, and the entrapment of flux was identified as the main cause for the formation of voids.
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2012.12.006