Loading…
Ag@Ni Core-Shell Nanowire Network for Robust Transparent Electrodes Against Oxidation and Sulfurization
Silver nanowire (Ag NW) based transparent electrodes are inherently unstable to moist and chemically reactive environment. A remarkable stability improvement of the Ag NW network film against oxidizing and sulfurizing environment by local electrodeposition of Ni along Ag NWs is reported. The optical...
Saved in:
Published in: | Small (Weinheim an der Bergstrasse, Germany) Germany), 2014-10, Vol.10 (20), p.4171-4181 |
---|---|
Main Authors: | , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | Silver nanowire (Ag NW) based transparent electrodes are inherently unstable to moist and chemically reactive environment. A remarkable stability improvement of the Ag NW network film against oxidizing and sulfurizing environment by local electrodeposition of Ni along Ag NWs is reported. The optical transmittance and electrical resistance of the Ni deposited Ag NW network film can be easily controlled by adjusting the morphology and thickness of the Ni shell layer. The electrical conductivity of the Ag NW network film is increased by the Ni coating via welding between Ag NWs as well as additional conductive area for the electron transport by electrodeposited Ni layer. Moreover, the chemical resistance of Ag NWs against oxidation and sulfurization can be dramatically enhanced by the Ni shell layer electrodeposited along the Ag NWs, which provides the physical barrier against chemical reaction and diffusion as well as the cathodic protection from galvanic corrosion.
The formation of Ag@Ni core–shell nanowire network film by partial embedding of Ag nanowires and electrodeposition of Ni layer enhances the chemical resistance of the Ag nanowire network film against oxidation and sulfurization. The mechanism can be explained by physical barrier against chemical diffusion and cathodic protection. This method provides facile route to the protection of transparent conductive electrodes. |
---|---|
ISSN: | 1613-6810 1613-6829 |
DOI: | 10.1002/smll.201400992 |