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Four-Parameter Hybrid–Bishop–Hill Model Applied to OFE Copper for the Evaluation of Elastic/Yield Limit

This study employs a novel stress-based Hybrid–Bishop–Hill yield model approach to evaluate the yield surface of oxygen-free electronic copper samples. The local yield surface is determined from three parameters of crystal orientation and one parameter of geometrically necessary dislocation (GND). A...

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Bibliographic Details
Published in:Metallurgical and materials transactions. A, Physical metallurgy and materials science Physical metallurgy and materials science, 2014-09, Vol.45 (10), p.4710-4722
Main Authors: Takahashi, Ribeka, Fullwood, David T., Adams, Brent L.
Format: Article
Language:English
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Summary:This study employs a novel stress-based Hybrid–Bishop–Hill yield model approach to evaluate the yield surface of oxygen-free electronic copper samples. The local yield surface is determined from three parameters of crystal orientation and one parameter of geometrically necessary dislocation (GND). All four local state variables can be rapidly determined by analysis of measured electron backscatter diffraction patterns. Estimates for the polycrystalline yield surface are obtained by standard averaging procedures. The shape of the yield surface is most influenced by the texture of the material, while the volume of the envelope scales with the average GND density. However, correlations between crystal orientation and GND content modify the yield surface shape and size. While correlations between GND density and crystal orientation are not strong for most copper samples, there are sufficient dependencies to demonstrate the benefits of the detailed four-parameter model. The four-parameter approach has potential for improving estimates of elastic-yield limit in all polycrystalline materials.
ISSN:1073-5623
1543-1940
DOI:10.1007/s11661-014-2368-0