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Flat flexible polymer heat pipes
Flat, flexible, lightweight, polymer heat pipes (FPHP) were fabricated. The overall geometry of the heat pipe was 130 mm × 70 mm × 1.31 mm. A commercially available low-cost film composed of laminated sheets of low-density polyethylene terephthalate, aluminum and polyethylene layers was used as the...
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Published in: | Journal of micromechanics and microengineering 2013-01, Vol.23 (1), p.15001-6 |
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container_title | Journal of micromechanics and microengineering |
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creator | Oshman, Christopher Li, Qian Liew, Li-Anne Yang, Ronggui Bright, Victor M Lee, Y C |
description | Flat, flexible, lightweight, polymer heat pipes (FPHP) were fabricated. The overall geometry of the heat pipe was 130 mm × 70 mm × 1.31 mm. A commercially available low-cost film composed of laminated sheets of low-density polyethylene terephthalate, aluminum and polyethylene layers was used as the casing. A triple-layer sintered copper woven mesh served as a liquid wicking structure, and water was the working fluid. A coarse nylon woven mesh provided space for vapor transport and mechanical rigidity. Thermal power ranging from 5 to 30 W was supplied to the evaporator while the device was flexed at 0°, 45° and 90°. The thermal resistance of the FPHP ranged from 1.2 to 3.0 K W−1 depending on the operating conditions while the thermal resistance for a similar-sized solid copper reference was a constant at 4.6 K W−1. With 25 W power input, the thermal resistance of the liquid-vapor core of the FPHP was 23% of a copper reference sample with identical laminated polymer material. This work shows a promising combination of technologies that has the potential to usher in a new generation of highly flexible, lightweight, low-cost, high-performance thermal management solutions. |
doi_str_mv | 10.1088/0960-1317/23/1/015001 |
format | article |
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The overall geometry of the heat pipe was 130 mm × 70 mm × 1.31 mm. A commercially available low-cost film composed of laminated sheets of low-density polyethylene terephthalate, aluminum and polyethylene layers was used as the casing. A triple-layer sintered copper woven mesh served as a liquid wicking structure, and water was the working fluid. A coarse nylon woven mesh provided space for vapor transport and mechanical rigidity. Thermal power ranging from 5 to 30 W was supplied to the evaporator while the device was flexed at 0°, 45° and 90°. The thermal resistance of the FPHP ranged from 1.2 to 3.0 K W−1 depending on the operating conditions while the thermal resistance for a similar-sized solid copper reference was a constant at 4.6 K W−1. With 25 W power input, the thermal resistance of the liquid-vapor core of the FPHP was 23% of a copper reference sample with identical laminated polymer material. This work shows a promising combination of technologies that has the potential to usher in a new generation of highly flexible, lightweight, low-cost, high-performance thermal management solutions.</description><identifier>ISSN: 0960-1317</identifier><identifier>EISSN: 1361-6439</identifier><identifier>DOI: 10.1088/0960-1317/23/1/015001</identifier><identifier>CODEN: JMMIEZ</identifier><language>eng</language><publisher>Bristol: IOP Publishing</publisher><subject>ALD ; Application fields ; Applied sciences ; Copper ; Exact sciences and technology ; flat ; Flats ; heat pipe ; Heat pipes ; Heat transfer ; Lightweight ; polymer ; Polymer industry, paints, wood ; Technology of polymers ; Thermal resistance ; Thermoelectricity ; Weight reduction</subject><ispartof>Journal of micromechanics and microengineering, 2013-01, Vol.23 (1), p.15001-6</ispartof><rights>2013 IOP Publishing Ltd</rights><rights>2014 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c358t-f45066a92dbb719e884267663982696b5b36de3f59a5abfcad7a2948853588ae3</citedby><cites>FETCH-LOGICAL-c358t-f45066a92dbb719e884267663982696b5b36de3f59a5abfcad7a2948853588ae3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27903,27904</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=26834448$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Oshman, Christopher</creatorcontrib><creatorcontrib>Li, Qian</creatorcontrib><creatorcontrib>Liew, Li-Anne</creatorcontrib><creatorcontrib>Yang, Ronggui</creatorcontrib><creatorcontrib>Bright, Victor M</creatorcontrib><creatorcontrib>Lee, Y C</creatorcontrib><title>Flat flexible polymer heat pipes</title><title>Journal of micromechanics and microengineering</title><addtitle>JMM</addtitle><addtitle>J. Micromech. Microeng</addtitle><description>Flat, flexible, lightweight, polymer heat pipes (FPHP) were fabricated. The overall geometry of the heat pipe was 130 mm × 70 mm × 1.31 mm. A commercially available low-cost film composed of laminated sheets of low-density polyethylene terephthalate, aluminum and polyethylene layers was used as the casing. A triple-layer sintered copper woven mesh served as a liquid wicking structure, and water was the working fluid. A coarse nylon woven mesh provided space for vapor transport and mechanical rigidity. Thermal power ranging from 5 to 30 W was supplied to the evaporator while the device was flexed at 0°, 45° and 90°. The thermal resistance of the FPHP ranged from 1.2 to 3.0 K W−1 depending on the operating conditions while the thermal resistance for a similar-sized solid copper reference was a constant at 4.6 K W−1. With 25 W power input, the thermal resistance of the liquid-vapor core of the FPHP was 23% of a copper reference sample with identical laminated polymer material. This work shows a promising combination of technologies that has the potential to usher in a new generation of highly flexible, lightweight, low-cost, high-performance thermal management solutions.</description><subject>ALD</subject><subject>Application fields</subject><subject>Applied sciences</subject><subject>Copper</subject><subject>Exact sciences and technology</subject><subject>flat</subject><subject>Flats</subject><subject>heat pipe</subject><subject>Heat pipes</subject><subject>Heat transfer</subject><subject>Lightweight</subject><subject>polymer</subject><subject>Polymer industry, paints, wood</subject><subject>Technology of polymers</subject><subject>Thermal resistance</subject><subject>Thermoelectricity</subject><subject>Weight reduction</subject><issn>0960-1317</issn><issn>1361-6439</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNqFkE1LAzEQhoMoWKs_QdiL4GXdTD5mk6MUq0LBi55DdpvglrS7Jl2w_96ULb16Ghied4bnJeQe6BNQpSqqkZbAoa4Yr6CiICmFCzIDjlCi4PqSzM7MNblJaZMBUKBmpFgGuy98cL9dE1wx9OGwdbH4dnk7dINLt-TK25Dc3WnOydfy5XPxVq4-Xt8Xz6uy5VLtSy8kRbSarZumBu2UEgxrRK4VQ42NbDiuHfdSW2kb39p1bZkWSskcV9bxOXmc7g6x_xld2pttl1oXgt25fkwGELXOaiAyKie0jX1K0XkzxG5r48EANcdGzNHWHG0N4wbM1EjOPZxe2NTa4KPdtV06hxkqLoRQmYOJ6_rBbPox7rL4P7f_AAnNbHc</recordid><startdate>20130101</startdate><enddate>20130101</enddate><creator>Oshman, Christopher</creator><creator>Li, Qian</creator><creator>Liew, Li-Anne</creator><creator>Yang, Ronggui</creator><creator>Bright, Victor M</creator><creator>Lee, Y C</creator><general>IOP Publishing</general><general>Institute of Physics</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7SR</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope><scope>JG9</scope></search><sort><creationdate>20130101</creationdate><title>Flat flexible polymer heat pipes</title><author>Oshman, Christopher ; Li, Qian ; Liew, Li-Anne ; Yang, Ronggui ; Bright, Victor M ; Lee, Y C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c358t-f45066a92dbb719e884267663982696b5b36de3f59a5abfcad7a2948853588ae3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>ALD</topic><topic>Application fields</topic><topic>Applied sciences</topic><topic>Copper</topic><topic>Exact sciences and technology</topic><topic>flat</topic><topic>Flats</topic><topic>heat pipe</topic><topic>Heat pipes</topic><topic>Heat transfer</topic><topic>Lightweight</topic><topic>polymer</topic><topic>Polymer industry, paints, wood</topic><topic>Technology of polymers</topic><topic>Thermal resistance</topic><topic>Thermoelectricity</topic><topic>Weight reduction</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Oshman, Christopher</creatorcontrib><creatorcontrib>Li, Qian</creatorcontrib><creatorcontrib>Liew, Li-Anne</creatorcontrib><creatorcontrib>Yang, Ronggui</creatorcontrib><creatorcontrib>Bright, Victor M</creatorcontrib><creatorcontrib>Lee, Y C</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of micromechanics and microengineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Oshman, Christopher</au><au>Li, Qian</au><au>Liew, Li-Anne</au><au>Yang, Ronggui</au><au>Bright, Victor M</au><au>Lee, Y C</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Flat flexible polymer heat pipes</atitle><jtitle>Journal of micromechanics and microengineering</jtitle><stitle>JMM</stitle><addtitle>J. Micromech. Microeng</addtitle><date>2013-01-01</date><risdate>2013</risdate><volume>23</volume><issue>1</issue><spage>15001</spage><epage>6</epage><pages>15001-6</pages><issn>0960-1317</issn><eissn>1361-6439</eissn><coden>JMMIEZ</coden><abstract>Flat, flexible, lightweight, polymer heat pipes (FPHP) were fabricated. The overall geometry of the heat pipe was 130 mm × 70 mm × 1.31 mm. A commercially available low-cost film composed of laminated sheets of low-density polyethylene terephthalate, aluminum and polyethylene layers was used as the casing. A triple-layer sintered copper woven mesh served as a liquid wicking structure, and water was the working fluid. A coarse nylon woven mesh provided space for vapor transport and mechanical rigidity. Thermal power ranging from 5 to 30 W was supplied to the evaporator while the device was flexed at 0°, 45° and 90°. The thermal resistance of the FPHP ranged from 1.2 to 3.0 K W−1 depending on the operating conditions while the thermal resistance for a similar-sized solid copper reference was a constant at 4.6 K W−1. With 25 W power input, the thermal resistance of the liquid-vapor core of the FPHP was 23% of a copper reference sample with identical laminated polymer material. This work shows a promising combination of technologies that has the potential to usher in a new generation of highly flexible, lightweight, low-cost, high-performance thermal management solutions.</abstract><cop>Bristol</cop><pub>IOP Publishing</pub><doi>10.1088/0960-1317/23/1/015001</doi><tpages>6</tpages></addata></record> |
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subjects | ALD Application fields Applied sciences Copper Exact sciences and technology flat Flats heat pipe Heat pipes Heat transfer Lightweight polymer Polymer industry, paints, wood Technology of polymers Thermal resistance Thermoelectricity Weight reduction |
title | Flat flexible polymer heat pipes |
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