Biodegradable Thin Metal Foils and Spin-On Glass Materials for Transient Electronics

Biodegradable substrates and encapsulating materials play critical roles in the development of an emerging class of semiconductor technology, generally referred as “transient electronics”, whose key characteristic is an ability to dissolve completely, in a controlled manner, upon immersion in ground...

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Bibliographic Details
Published in:Advanced functional materials 2015-03, Vol.25 (12), p.1789-1797
Main Authors: Kang, Seung-Kyun, Hwang, Suk-Won, Yu, Sooyoun, Seo, Jung-Hun, Corbin, Elise A., Shin, Jiho, Wie, Dae Seung, Bashir, Rashid, Ma, Zhenqiang, Rogers, John A.
Format: Article
Language:English
Subjects:
Biocompatibility
Biodegradability
biodegradable materials
biodegradable metal foils
degradable metal substrates
Dissolution
Electronic components
Electronic devices
Electronics
Reaction kinetics
Semiconductors
spin-on glass
transient electronics
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Summary:Biodegradable substrates and encapsulating materials play critical roles in the development of an emerging class of semiconductor technology, generally referred as “transient electronics”, whose key characteristic is an ability to dissolve completely, in a controlled manner, upon immersion in ground water or biofluids. The results presented here introduce the use of thin foils of Mo, Fe, W, or Zn as biodegradable substrates and silicate spin‐on‐glass (SOG) materials as insulating and encapsulating layers, with demonstrations of transient active (diode and transistor) and passive (capacitor and inductor) electronic components. Complete measurements of electrical characteristics demonstrate that the device performance can reach levels comparable to those possible with conventional, nontransient materials. Dissolution kinetics of the foils and cytotoxicity tests of the SOG yield information relevant to use in transient electronics for temporary biomedical implants, resorbable environmental monitors, and reduced waste consumer electronics. Materials, fabrication strategies, dissolution kinetics, and biocompatibility studies of transient electronics systems built on thin metal foils passivated by layers of spin‐on glass (SOG) are presented. Transient electronic components exhibit comparable performances to conventional, nontransient substrates. Dissolution kinetics of the materials cured at different temperatures reveal key aspects of their corrosion chemistry, and in vitro cell cultures demonstrate their biocompatibility.
ISSN:1616-301X
1616-3028
DOI:10.1002/adfm.201403469