Void formation and its impact on Cu Sn intermetallic compound formation

• Published in: Journal of alloys and compounds 2016-08, Vol.677, p.127-138
• Main Authors: Ross, Glenn, Vuorinen, Vesa, Paulasto-Kröckel, Mervi
• Format: Article
• Language: English
• Subjects: Bonding; Current density; Density; Diffusion barriers; Electroplating; Formations; Intermetallics; Voids
• ISSN: 0925-8388
• DOI: 10.1016/j.jallcom.2016.03.193

Void formation in the Cusingle bond Sn system has been identified as a major reliability issue with small volume electronic interconnects. Voids form during the interdiffusion of electrochemically deposited Cu and Sn, with varying magnitude and density. Electroplating parameters include the electrolytic chemistry composition and the electroplating current density, all of which appear to effect the voiding characteristics of the Cusingle bond Sn system. In addition, interfacial voiding affects the growth kinetics of the Cu sub(3)Sn and Cu sub(6)Sn sub(5) intermetallic compounds of the Cusingle bond Sn system. The aim here is to present voiding data as a function of electroplating chemistry and current density over a duration (up to 72 h) of isothermal annealing at 423 K (150 degree C). Voiding data includes the average interfacial void size and average void density. Voids sizes grew proportionally as a function of thermal annealing time, whereas the void density grew initially very quickly but tended to saturate at a fixed density. A morphological evolution analysis called the physicochemical approach is utilised to understand the processes that occur when a voided Cu/Cu sub(3)Sn interface causes changes to the IMC phase growth. The method is used to simulate the intermetallic thickness growths' response to interfacial voiding. The Cu/Cu sub(3)Sn interface acts as a Cu diffusion barrier disrupting the diffusion of Cu. This resulted in a reduction in the Cu sub(3)Sn thickness and an accelerated growth rate of Cu sub(6)Sn sub(5).