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Physical mechanism of surface blistering process in H-implanted Ge

Hydrogen (H) implantation-induced damage was investigated in (100) germanium (Ge) for the physical understanding of the surface blistering phenomenon. Ge samples were implanted at liquid nitrogen and room temperatures using 100 keV H⁺ ions with a fluence of 1 × 10¹⁷ cm⁻². The hydrogen ion current de...

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Bibliographic Details
Published in:Journal of materials science 2016-06, Vol.51 (11), p.5397-5402
Main Authors: Dadwal, U., Kumar, Praveen, Hähnel, A., Singh, R.
Format: Article
Language:English
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Summary:Hydrogen (H) implantation-induced damage was investigated in (100) germanium (Ge) for the physical understanding of the surface blistering phenomenon. Ge samples were implanted at liquid nitrogen and room temperatures using 100 keV H⁺ ions with a fluence of 1 × 10¹⁷ cm⁻². The hydrogen ion current density was kept at 10 µA cm⁻² during the implantation. H-implanted samples were subsequently annealed at higher temperatures up to 500 °C in order to trigger surface blistering. X-ray diffraction studies of the H-implanted samples showed the existence of damage-induced stress and its prominent dependence on the implantation temperature. Damage-induced stress was found to be sufficiently large to guide the hydrogen diffusion and defects agglomeration. Microstructural investigations of the H-induced damage were carried out using cross-sectional transmission electron microscopy and annular dark-field scanning transmission electron microscopy. It showed that H-induced agglomerated defects were in the form of platelets surrounded by the strain field. Strain field strains the matrix lattice for the eventual occurrence of surface blistering in H-implanted Ge.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-016-9842-6