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Optimum structures for gamma‐ray radiation resistant SiC‐MOSFETs

In order to develop highly radiation‐tolerant SiC MOSFETs, we investigated the dependence of the gamma‐ray radiation response on the gate oxide thickness and nitridation processes, used for oxide growth and p‐well implantation. SiC MOSFETs with a thick gate oxide (60 nm) showed a rapid decrease in t...

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Published in:Physica status solidi. A, Applications and materials science Applications and materials science, 2017-04, Vol.214 (4), p.1600425-n/a
Main Authors: Mitomo, Satoshi, Matsuda, Takuma, Murata, Koichi, Yokoseki, Takashi, Makino, Takahiro, Takeyama, Akinori, Onoda, Shinobu, Ohshima, Takeshi, Okubo, Shuichi, Tanaka, Yuki, Kandori, Mikio, Yoshie, Toru, Hijikata, Yasuto
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Language:English
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Summary:In order to develop highly radiation‐tolerant SiC MOSFETs, we investigated the dependence of the gamma‐ray radiation response on the gate oxide thickness and nitridation processes, used for oxide growth and p‐well implantation. SiC MOSFETs with a thick gate oxide (60 nm) showed a rapid decrease in the threshold voltage shift ΔVth of more than 400 kGy, and transitioned to the normally‐on state at lower doses than those with a thin gate oxide (35 nm). The MOSFETs with gate oxides treated with lower concentrations of N2O (10%) demonstrated a higher radiation tolerance (ΔVth, channel mobility, and subthreshold swing) than with a 100% N2O treatment. The MOSFETs with more p‐well implantation steps (three steps) showed a smaller negative shift of the threshold voltage relative to those implanted with two steps.
ISSN:1862-6300
1862-6319
DOI:10.1002/pssa.201600425