Control of Knock-On Damage for 3D Atomic Scale Quantification of Nanostructures: Making Every Electron Count in Scanning Transmission Electron Microscopy

• Published in: Physical review letters 2019-02, Vol.122 (6), p.066101-066101, Article 066101
• Main Authors: Van Aert, Sandra, De Backer, Annick, Jones, Lewys, Martinez, Gerardo T, Béché, Armand, Nellist, Peter D
• Format: Article
• Language: English
• Subjects: Atomic properties; Atomic structure; Counting; Damage; Design optimization; High energy electrons; Image transmission; Nanostructure; Scanning electron microscopy; Scanning transmission electron microscopy; Transmission electron microscopy
• ISSN: 0031-9007; 1079-7114
• DOI: 10.1103/PhysRevLett.122.066101

Understanding nanostructures down to the atomic level is the key to optimizing the design of advanced materials with revolutionary novel properties. This requires characterization methods capable of quantifying the three-dimensional (3D) atomic structure with the highest possible precision. A successful approach to reach this goal is to count the number of atoms in each atomic column from 2D annular dark field scanning transmission electron microscopy images. To count atoms with single atom sensitivity, a minimum electron dose has been shown to be necessary, while on the other hand beam damage, induced by the high energy electrons, puts a limit on the tolerable dose. An important challenge is therefore to develop experimental strategies to optimize the electron dose by balancing atom-counting fidelity vs the risk of knock-on damage. To achieve this goal, a statistical framework combined with physics-based modeling of the dose-dependent processes is here proposed and experimentally verified. This model enables an investigator to theoretically predict, in advance of an experimental measurement, the optimal electron dose resulting in an unambiguous quantification of nanostructures in their native state with the highest attainable precision.