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Fabrication of Two-Dimensional and Three-Dimensional High-Resolution Binder-Free Graphene Circuits Using a Microfluidic Approach for Sensor Applications
In this study, a simple microfluidic method, which can be universally applied to different rigid or flexible substrates, was developed to fabricate high-resolution, conductive, two-dimensional and three-dimensional microstructured graphene-based electronic circuits. The method involves controlled an...
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Published in: | ACS applied materials & interfaces 2020-03, Vol.12 (11), p.13529-13539 |
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Main Authors: | , , , , , , , , |
Format: | Article |
Language: | English |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | In this study, a simple microfluidic method, which can be universally applied to different rigid or flexible substrates, was developed to fabricate high-resolution, conductive, two-dimensional and three-dimensional microstructured graphene-based electronic circuits. The method involves controlled and selective filling of microchannels on substrate surfaces with a conductive binder-free graphene nanoplatelet (GNP) solution. The ethanol-thermal reaction of GNP solution at low temperatures (∼75 °C) prior to microchannel filling (preheating) can further reduce the GNP andprovide a homogeneous GNP solution, which in turn enhances conductivity, reduces sheet resistance (∼0.05 kΩ sq–1), enables room-temperature fabrication, and eliminates harsh postprocessing, which makes this fabrication technique compatible with degradable substrates. This method can also be used in combination with 3D printing to fabricate 3D circuits. The feature sizes of the graphene patterns can range from a few micrometers (down to ∼15 μm in width and ∼5 μm in depth) to a few millimeters and use very small amounts of GNP solution (∼2.5 mg of graphene to obtain ∼0.1 kΩ sq–1 of sheet resistance for 1 cm2). This microfluidic approach can also be implemented using other conductive liquids, such as conductive graphene–silver solutions. This technology has the potential to pave the way for low-cost, disposable, and biodegradable circuits for a range of electronic applications including near-field communication antennas and pressure or strain sensors. |
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ISSN: | 1944-8244 1944-8252 |
DOI: | 10.1021/acsami.9b23460 |