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Nanodiamond-stabilized Pickering emulsions: Microstructure and rheology
[Display omitted] We envisage the use of hydroxylated detonation nanodiamonds (ND-OH), a relatively novel carbonaceous filler with high adsorption activity, small size, and large surface area to create Pickering emulsions. The emulsion behavior under shear and the extent to which the microstructure...
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Published in: | Journal of colloid and interface science 2020-11, Vol.580, p.180-191 |
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Main Authors: | , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | [Display omitted]
We envisage the use of hydroxylated detonation nanodiamonds (ND-OH), a relatively novel carbonaceous filler with high adsorption activity, small size, and large surface area to create Pickering emulsions. The emulsion behavior under shear and the extent to which the microstructure can rebuild after breakdown is dependent on its yield stress.
Using a model system consisting of isopropyl palmitate and water stabilized by ND-OH particles, we investigate the stability of these emulsions, their microstructure and rheological behavior as a function of ND-OH concentration.
Confocal microscopy reveals that increasing ND-OH concentration results in smaller droplet sizes in the emulsions. This behavior is consistent with our rheological results of higher elastic modulus G′ and yield stress of the emulsion with increased ND-OH, as the presence of smaller droplets facilitates the formation of a densely packed network. We find the rheological behavior of these emulsions to be a hybrid of colloidal gels and surfactant-stabilized emulsions, with interparticle interactions and droplets deformability dictating their elasticity and yield stress behavior. Structure recovery following large shear reveals the degree of microstructure recovery to depend on the applied stress, with the recovered modulus collapsing into a single master-curve when the applied stress is scaled by the yield stress. |
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ISSN: | 0021-9797 1095-7103 |
DOI: | 10.1016/j.jcis.2020.07.030 |