Active Ultrahigh‐Q (0.2 × 106) THz Topological Cavities on a Chip

Rapid scaling of semiconductor devices has led to an increase in the number of processor cores and integrated functionalities onto a single chip to support the growing demands of high‐speed and large‐volume consumer electronics. To meet this burgeoning demand, an improved interconnect capacity in te...

Full description

Saved in:
Bibliographic Details
Published in:Advanced materials (Weinheim) 2022-07, Vol.34 (27), p.e2202370-n/a
Main Authors: Kumar, Abhishek, Gupta, Manoj, Pitchappa, Prakash, Tan, Thomas Caiwei, Chattopadhyay, Udvas, Ducournau, Guillaume, Wang, Nan, Chong, Yidong, Singh, Ranjan
Format: Article
Language:English
Subjects:
6G communication
Bandwidths
Circuit design
CMOS
Coupling
Density
Dynamic control
Engineering Sciences
Holes
Integrated circuits
Materials science
Microprocessors
Modulation
on‐chip modulators
Optical control
Photonics
quantum and topological photonics
Semiconductor devices
Semiconductors
Silicon
Terahertz frequencies
THz photonics
THz topological integrated circuits (TTICs)
Topology
ultrahigh‐Q cavities
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!