Monitoring the deposition of Cu thin film using the double exposure holographic interferometry technique

The double exposure holographic interferometry (DEHI) technique is used to study the surface deformation of stainless steel plate when Cu is deposited onto it using the electrodeposition method. Cu(NO 3) 2 solutions of different normalities were used for deposition and the steel plate was exposed fo...

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Bibliographic Details
Published in:Thin solid films 1997-06, Vol.301 (1), p.62-64
Main Authors: Dongre, M.B, Fulari, V.J, Kulkarni, H.R
Format: Article
Language:English
Subjects:
Copper
Deposition process
Surface defects
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Summary:The double exposure holographic interferometry (DEHI) technique is used to study the surface deformation of stainless steel plate when Cu is deposited onto it using the electrodeposition method. Cu(NO 3) 2 solutions of different normalities were used for deposition and the steel plate was exposed for different intervals of time. It is observed that the fringe spacing changes with the concentration of the solution as well as the time of deposition. This effect is due to the increase in thickness of Cu films. An attempt has been made to measure the thickness and mass of deposited films by DEHI technique.
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(96)09599-5