A modelling tool for the thermal optimisation of the reflow soldering of printed circuit assemblies

• Published in: Finite elements in analysis and design 1998-07, Vol.30 (1), p.47-63
• Main Authors: Sarvar, Farhad, Conway, Paul P
• Format: Article
• Language: English
• Subjects: PCA; Reflow Soldering; Simulation; Thermal
• ISSN: 0168-874X; 1872-6925
• DOI: 10.1016/S0168-874X(98)00025-0

Thermal history variation within printed circuit assemblies (PCAs) during reflow soldering is considered one of the main drivers for manufacturing defects. It is recognised that predictive tools could be used to identify the temperature variations that arise during the reflow process and, in conjunction with experimentally derived data, determine their impact on manufacturing quality. A predictive model would also be useful to a designer for rearranging component placement for thermal mass distribution, hence enabling the optimisation of the design for manufacture prior to final design commitment. Likewise, such a predictive tool could be utilised for off-line optimisation of reflow oven profiles and in the design of more thermally efficient production equipment. This paper describes the development of representative process models of the reflow soldering of PCAs and outlines some of the more important parameters to consider for accurate simulation of the reflow process. Furthermore, the utilisation of the predictive model is presented as a tool for a number of end uses applicable to different application domains, namely: process configuration for any given PCA; selection of the most appropriate process and as a product design or verification tool to improve thermal mass distribution and hence temperature history during processing.