Bismaleimide resin modified with diallyl bisphenol A and diallyl p-phenyl diamine for resin transfer molding

• Published in: Journal of applied polymer science 2001-06, Vol.80 (12), p.2245-2250
• Main Authors: Li, Zhongming, Yang, Mingbo, Huang, Rui, Zhang, Meidong, Feng, Jianmin
• Format: Article
• Language: English
• Subjects: Applied sciences; bismaleimidodiphenol methane; Chemical properties; diallyl bisphenol A; diallyl p-phenyl diamine; Exact sciences and technology; Organic polymers; Physicochemistry of polymers; Polycondensation; Polymer industry, paints, wood; Preparation, kinetics, thermodynamics, mechanism and catalysts; Properties and testing; reactive diluents; resin transfer molding; Technology of polymers
• ISSN: 0021-8995; 1097-4628
• DOI: 10.1002/app.1328

O,O′‐diallyl bisphenol A (DBA) and N,N′‐diallyl p‐phenyl diamine (DPD) were used for the reactive diluents of 4,4′‐bismaleimidodiphenol methane (BDM). The objective was to obtain a modified BDM resin system suitable for resin transfer molding (RTM) process to prepare the advanced composites. The processing behavior was determined by time–temperature–viscosity curves, gel characteristics, and differential scanning calorimetry (DSC). The injection temperature of the resin system in RTM could be 80°C, at which its apparent viscosity was only 0.31 Pa/s, and the apparent viscosity was still less than 1.00 Pa/s after the resin was held at 80°C for 16 h. The gel time test result indicated that at low temperatures, the reactivity of the resin system is low, whereas at high temperatures, the resin could cure very fast, which was beneficial to RTM. The postcure of the cured resin at a given temperature was necessary because the resin had a wide and flat cure exothermic peak, observed by DSC curve. The cured resin displayed both high heat and hot/wet resistance and high mechanical properties, especially tensile strength, tensile modulus, and flexural strength at room temperature, which reached 96.2 MPa, 4.8 GPa, and 121.4 MPa, respectively. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 2245–2250, 2001